Systems and methods for measuring intensity in a lithographic alignment apparatus
A metrology system includes a radiation source, an adjustable diffractive element, an optical system, an optical element, and a processor. The radiation source generates radiation. The adjustable diffractive element diffracts the radiation to generate first and second beams of radiation. The first and second beams have first and second different non-zero diffraction orders, respectively. The optical system directs the first and second beams toward a target structure such that first and second scattered beams of radiation are generated based on the first and second beams, respectively. The metrology system adjusts a phase difference of the first and second scattered beams. The optical element interferes the first and second scattered beams at an imaging detector that generates a detection signal. The processor receives and analyzes the detection signal to determine a property of the target structure based on the adjusted phase difference.
1. A metrology detection method comprising:
generating a radiation beam;
directing the radiation beam toward a target structure to generate first and second scattered beams of radiation from the target structure, wherein the first and second scattered beams comprise respective first and second non-zero diffraction orders, the second non-zero diffraction order being different from the first non-zero diffraction order;
receiving the first scattered beam and the second scattered beam of radiation from the target structure;
directing the first scattered beam towards an imaging detector and blocking the second scattered beam using a blocking optical element;
determining a first intensity signal corresponding to the first scattered beam at the imaging detector;
directing the second scattered beam towards the imaging detector and blocking the first scattered beam using the blocking optical element;
determining a second intensity signal corresponding to the second scattered beam at the imaging detector;
generating, at the imaging detector, a detection signal corresponding to a difference between the first intensity signal and the second intensity signal; and
determining a property of the target structure based on at least the detection signal.
2. The metrology detection method of claim 1 , further comprising:
modulating the first scattered beam to isolate a first AC component of the first scattered beam; and
measuring the first intensity signal based on the first AC component.
3. The metrology detection method of claim 1 , further comprising:
modulating the second scattered beam to isolate a second AC component of the second scattered beam; and
measuring the second intensity signal based on the second AC component.
4. The metrology detection method of claim 1 , further comprising:
producing or adjusting a phase difference of the first and second scattered beams; and
interfering the first and second scattered beams at the imaging detector.
5. The metrology detection method of claim 4 , further comprising:
generating a second detection signal based on the adjusted phase difference; and
determining a property of the target structure based on the first detection signal and the second detection signal.
6. The metrology detection method of claim 1 , wherein the determining the property of the target structure comprises determining an alignment mark symmetry.
7. The metrology detection method of claim 5 , wherein the determining the property of the target structure comprises determining an alignment position.
8. The metrology detection method of claim 4 , wherein the producing or adjusting the phase difference is performed, in part, on the determined property of the target structure.
9. The metrology detection method of claim 8 , wherein the determining comprises determining an alignment mark symmetry.
10. The metrology detection method of claim 1 , wherein the blocking optical element comprises a rotating shutter apparatus.
11. The metrology detection method of claim 1 , wherein the blocking optical element comprises a mirror array.
12. A metrology system comprising:
a radiation source configured to generate a radiation beam;
an optical system configured to:
direct the radiation beam toward a target structure to generate first and second scattered beams of radiation from the target structure, wherein the first and second scattered beams comprise respective first and second non-zero diffraction orders, the second non-zero diffraction order being different from the first non-zero diffraction order, and
receive the first scattered beam and the second scattered beam of radiation from the target structure;
an optical element comprising a blocking optical element, the optical element configured to:
direct the first scattered beam towards an imaging detector and block the second scattered beam using the blocking optical element, and
direct the second scattered beam towards the imaging detector and block the first scattered beam using the blocking optical element;
wherein the imaging detector is configured to:
determine a first intensity signal of the first scattered beam,
determine a second intensity signal of the second scattered beam, and
generate a detection signal corresponding to a difference between the first intensity signal and the second intensity signal; and
a processor configured to determine a property of the target structure based on at least the detection signal.
13. The metrology system of claim 12 , further comprising:
an optical modulating element configured to modulate the first scattered beam to isolate a first AC component of the first scattered beam;
wherein the imaging detector is further configured to measure the first intensity signal based on the first AC component.
14. The metrology system of claim 12 , further comprising:
an optical modulating element configured to modulate the second scattered beam to isolate a second AC component of the first scattered beam;
wherein the imaging detector is further configured to measure the second intensity signal based on the second AC component.
15. The metrology system of claim 12 , further comprising:
a second optical element configured to interfere the first and second scattered beams at an imaging detector.
16. The metrology system of claim 15 , wherein the imaging detector is further configured to:
generate a second detection signal based on an adjusted phase difference; and
determine a property of the target structure based on the first detection signal and the second detection signal.
17. The metrology system of claim 12 , wherein the property of the target structure comprises an alignment mark symmetry.
18. The metrology system of claim 16 , wherein the property of the target structure comprises an alignment position.
19. The metrology system of claim 16 , wherein the imaging detector is further configured to determine the phase adjustment, in part, on the determined property of the target structure.
20. A lithographic apparatus comprising:
an illumination system configured to illuminate a pattern of a patterning device;
a projection system configured to project an image of the pattern onto a substrate; and
a metrology system comprising:
a radiation source configured to generate a radiation beam;
an optical system configured to:
direct the radiation beam toward a target structure to generate first and second scattered beams of radiation from the target structure, wherein the first and second scattered beams comprise respective first and second non-zero diffraction orders, the second non-zero diffraction order being different from the first non-zero diffraction order, and
receive the first scattered beam and the second scattered beam of radiation from the target structure;
an optical element comprising a blocking optical element, the optical element configured to:
direct the first scattered beam towards an imaging detector and block the second scattered beam using the blocking optical element, and
direct the second scattered beam towards the imaging detector and block the first scattered beam using the blocking optical element;
an imaging detector configured to:
determine a first intensity signal of the first scattered beam,
determine a second intensity signal of the second scattered beam, and
generate a detection signal corresponding to a difference between the first intensity signal and the second intensity signal; and
a processor configured to determine a property of the target structure based on at least the detection signal.