BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS
A bond wire has an outer layer formed of a conductive material and a core formed of a non-conductive material. The non-conductive material is blended with conductive fillers to enhance electrical and/or thermal conductivity characteristics of the bond wire.
1 . A method for manufacturing a bond wire, comprising:
providing a core material to a co-extrusion die of an extruder, the core material comprising a conductive filler material blended with a non-conductive material;
providing a conductive material to the co-extrusion die of the extruder;
causing the core material to form a core as the core material passes through the co-extrusion die during a co-extrusion process, the core having the conductive filler material; and
causing the conductive material to form an outer layer on the core during the co-extrusion process to create the bond wire.
2 . The method of claim 1 , further comprising providing the bond wire to a cooling die to cool the bond wire.
3 . The method of claim 1 , wherein a ratio of the conductive filler material to the non-conductive material is based, at least in part, on expected thermal conductivity characteristics of the bond wire.
4 . The method of claim 1 , further comprising:
determining a diameter of the core; and
causing the co-extrusion die to form the core having the determined diameter.
5 . The method of claim 4 , wherein the diameter of the core is based, at least in part, on expected thermal conductivity characteristics of the bond wire.
6 . The method of claim 1 , wherein the conductive material is gold.
7 . The method of claim 1 , wherein the conductive filler material is one or more of graphene and metallic powder.
8 . The method of claim 1 , wherein the non-conductive material is comprised of recycled materials.
9 . The method of claim 1 , wherein the core comprises between approximately ten percent to approximately forty percent of the bond wire.
10 . A bond wire, comprising:
a core comprising:
a non-conductive material; and
a conductive filler blended with the non-conductive material; and
an outer layer surrounding the core, the outer layer comprising a conductive material.
11 . The bond wire of claim 10 , wherein a ratio of the conductive filler to the non-conductive material is based, at least in part, on expected thermal conductivity characteristics of the bond wire.
12 . The bond wire of claim 10 , wherein a diameter of the core is based, at least in part, on expected thermal conductivity characteristics of the bond wire.
13 . The bond wire of claim 10 , wherein the outer layer is comprised of gold.
14 . The bond wire of claim 10 , wherein the conductive filler is one or more of graphene and metallic powder.
15 . The bond wire of claim 10 , wherein the non-conductive material is comprised of recycled materials.
16 . The bond wire of claim 10 , wherein the core comprises between approximately ten percent to approximately forty percent of the bond wire.
17 . A bond wire for a semiconductor device, comprising:
a core means, comprising:
a non-conductive recycled material; and
a conductive filler blended with the non-conductive recycled material, the core means comprising between approximately ten percent to approximately forty percent of the bond wire; and
a coating means surrounding the core means, the coating means comprising a conductive material.
18 . The bond wire of claim 17 , wherein the conductive filler is one or more of graphene and metallic powder.
19 . The bond wire of claim 17 , wherein a ratio of the conductive filler to the non-conductive recycled material is based, at least in part, on expected thermal conductivity characteristics of the bond wire.
20 . The bond wire of claim 17 , wherein the conductive material is selected from a group comprising gold, silver, aluminum and copper.