IP Library Granted Patent US 12,502,684
Granted Patent B2
US 12,502,684 · App. 18/424,018 · Granted Dec 23, 2025

Substrate treatment apparatus having heating part

Inventors: Taek Youb Lee (Cheonan-si, KR); Jun Hwan Lee (Cheonan-si, KR); Man Je Bang (Cheonan-si, KR)
Assignee: DEVICE CO., LTD.
B05B13/0228B05B7/0075B05B7/16
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Quick Facts
Patent No.
US 12,502,684
App. No.
18/424,018
Granted
Dec 23, 2025
Kind
B2
Abstract

The present disclosure relates to a substrate treatment apparatus including: a chuck base connected to a driving shaft in such a way as to be rotatable together with the driving shaft and having a spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part; a fluid supply unit for supplying treatment liquid to an upper surface of the substrate; a back nozzle assembly mounted through a hollow portion formed at the center of the chuck base to spray treatment liquid onto a lower surface of the substrate; cover glass disposed between the spin chuck and the back nozzle assembly; a heating part disposed between the spin chuck and the back nozzle assembly in a space between the cover glass and the chuck support part; and a heat sink contacting a lower surface of the heating part.

Claims (30)

1 . A substrate treatment apparatus having a heating part, comprising:

a chuck base connected to a driving shaft in such a way as to be rotatable together with the driving shaft and having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on a lower portion of inner peripheral surface of the spin chuck;

a fluid supply unit for supplying treatment liquid to an upper surface of the substrate;

a back nozzle assembly mounted through a hollow portion formed at a center of the chuck base to spray treatment liquid onto a lower surface of the substrate;

a cover glass disposed between the spin chuck and the back nozzle assembly;

the heating part disposed between the spin chuck and the back nozzle assembly in a space between the cover glass and the chuck support part; and

a heat sink contacting a lower surface of the heating part,

wherein the heat sink has a cooling water path located therein to flow cooling water therealong.

2 . The substrate treatment apparatus according to claim 1 , wherein when-viewed from above the substrate, the cooling water path has an inlet and an outlet located inside the driving shaft in such a way as to be connected to a cooling water circulation line.

3 . A substrate treatment apparatus having a heating part, comprising:

a chuck base connected to a driving shaft in such a way as to be rotatable together with the driving shaft and having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on a lower portion of inner peripheral surface of the spin chuck;

a fluid supply unit for supplying treatment liquid to an upper surface of the substrate;

a back nozzle assembly mounted through a hollow portion formed at a center of the chuck base to spray treatment liquid onto a lower surface of the substrate;

a cover glass disposed between the spin chuck and the back nozzle assembly;

the heating part disposed between the spin chuck and the back nozzle assembly in a space between the cover glass and the chuck support part; and

a heat sink contacting a lower surface of the heating part,

wherein the back nozzle assembly comprises:

a purge gas spray hole formed on a given longitudinal portion of the back nozzle assembly in a circumference direction thereof above the heating part; and a first purge gas supply path located in the back nozzle assembly in such a way as to communicate with the purge gas spray hole.

4 . The substrate treatment apparatus according to claim 3 , wherein the back nozzle assembly comprises:

a coupling groove formed on outer peripheral surface of the back nozzle assembly to insert the cover glass thereinto; and

a second purge gas supply path located in the back nozzle assembly in such a way as to communicate to the coupling groove.

5 . The substrate treatment apparatus according to claim 4 , wherein a top surface of the coupling groove and a portion of a top surface of the cover glass facing the top surface of the coupling groove are inclined upward toward a center of the driving shaft.

6 . A substrate treatment apparatus having a heating part, comprising:

a chuck base connected to a driving shaft in such a way as to be rotatable together with the driving shaft and having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on a lower portion of inner peripheral surface of the spin chuck;

a fluid supply unit for supplying treatment liquid to an upper surface of the substrate;

a back nozzle assembly mounted through a hollow portion formed at a center of the chuck base to spray treatment liquid onto a lower surface of the substrate;

a cover glass disposed between the spin chuck and the back nozzle assembly;

the heating part disposed between the spin chuck and the back nozzle assembly in a space between the cover glass and the chuck support part; and

a heat sink contacting a lower surface of the heating part,

wherein the heating part and the heat sink are configured to be movable in upward and downward directions.

Assignments (3)
CHANGE OF NAME Recorded Jun 24, 2025
From: DEVICEENG CO., LTD.
To: DEVICE CO., LTD.
Reel/Frame 071723/0825 →
CHANGE OF ADDRESS Recorded Jun 24, 2025
From: DEVICEENG CO., LTD.
To: DEVICEENG CO., LTD.
Reel/Frame 071723/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2024
From: LEE, TAEK YOUB; LEE, JUN HWAN; BANG, MAN JE
To: DEVICEENG CO., LTD.
Reel/Frame 066378/0525 →
Priority Claims (1)
KR 10-2023-0123246 · Sep 15, 2023 · national
Continuity (1)
Related Publication 20250091076A1 · Mar 20, 2025
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