Patent Assignment
Reel/Frame 071723/0825
Change of Name
Recorded: 2025-06-24
Pages: 9
Assignor
DEVICEENG CO., LTD.
Executed: 2025-04-01
Assignee
DEVICE CO., LTD.
39 SEONGMUN-GIL, SEONGGEO-EUP,, SEOBUK-GU, CHEONAN-SI, KOREA, REPUBLIC OF
Covered Properties
(17)
Substrate Support Assembly for Substrate Treatment Apparatus
Substrate Support Assembly for Substrate Treatment Apparatus
Substrate Treatment Apparatus Having Bowl Assembly
Substrate Treatment Apparatus Having Back Nozzle Assembly
Substrate Treatment Apparatus Having Exhaust Structure
Device for Etching the Periphery Edge of a Substrate
Substrate Treating Apparatus Comprising Ultrasonic Wave Cleaning Unit
Substrate Support Assembly for Substrate Treatment Apparatus
Application:
18/423,578 →
Publication:
US 2025/0054802
Substrate Treatment Apparatus
Treatment Liquid Spray Nozzle
Application:
18/423,913 →
Publication:
US 2025/0083160
Substrate Treatment Apparatus Having Heating Part
Substrate Treatment Apparatus Having Heating Part
Substrate Treatment Apparatus Having Heating Part
Treatment Liquid Spray Nozzle
Application:
18/609,862 →
Publication:
US 2025/0229279
Device for Etching the Periphery Edge of a Substrate and Method for Controlling Etching Thereof
Device for Etching the Periphery Edge of a Substrate Comprising Substrate Sensing Unit
Wafer Container Cleaning Device
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 24, 2011
From: BANG, IN HO; PARK, BUM SUN; CHOI, BONG JIN
To: DEVICEENG CO., LTD.
Reel/Frame 025687/0563 →
Assignment of Assignor's Interest
Mar 31, 2022
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 059555/0203 →
Assignment of Assignor's Interest
Mar 31, 2022
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 059452/0956 →
Assignment of Assignor's Interest
Mar 31, 2022
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 059452/0945 →
Assignment of Assignor's Interest
Mar 31, 2022
From: LEE, TAEK YOUB; LEE, JUN HWAN; BANG, MAN JE
To: DEVICEENG CO., LTD.
Reel/Frame 059555/0206 →
Assignment of Assignor's Interest
Mar 31, 2022
From: LEE, TAEK YOUB
To: LTD., DEVICEENG C
Reel/Frame 059452/0942 →
Assignment of Assignor's Interest
May 18, 2022
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 060116/0711 →
Assignment of Assignor's Interest
May 18, 2022
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 060116/0714 →
Assignment of Assignor's Interest
Jul 26, 2022
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 060926/0803 →
Assignment of Assignor's Interest
Jul 26, 2022
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 060926/0806 →
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 059452 Frame: 0942. Assignor(S) Hereby Confirms the Assignment .
Dec 20, 2023
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD
Reel/Frame 066097/0791 →
Assignment of Assignor's Interest
Jan 26, 2024
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 066258/0661 →
Assignment of Assignor's Interest
Jan 29, 2024
From: LEE, TAEK YOUB; LEE, HEE WON
To: DEVICEENG CO., LTD.
Reel/Frame 066378/0657 →
Assignment of Assignor's Interest
Jan 29, 2024
From: LEE, TAEK YOUB; LEE, JUN HWAN; BANG, MAN JE
To: DEVICEENG CO., LTD.
Reel/Frame 066378/0525 →
Assignment of Assignor's Interest
Jan 29, 2024
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 066283/0132 →
Assignment of Assignor's Interest
Jan 29, 2024
From: LEE, TAEK YOUB; LEE, JUN HWAN
To: DEVICEENG CO., LTD.
Reel/Frame 066378/0517 →
Assignment of Assignor's Interest
Jan 29, 2024
From: LEE, TAEK YOUB; LEE, HEE WON
To: DEVICEENG CO., LTD.
Reel/Frame 066378/0667 →
Assignment of Assignor's Interest
Mar 19, 2024
From: LEE, TAEK YOUB
To: DEVICEENG CO., LTD.
Reel/Frame 066828/0573 →
Change of Address
Jun 24, 2025
From: DEVICEENG CO., LTD.
To: DEVICEENG CO., LTD.
Reel/Frame 071723/0220 →