Forming metal contacts on metal gates
A semiconductor structure includes a metal gate structure having a gate dielectric layer and a gate electrode. A topmost surface of the gate dielectric layer is above a topmost surface of the gate electrode. The semiconductor structure further includes a conductive layer disposed on the gate electrode of the metal gate structure, the conductive layer having a bottom portion disposed laterally between sidewalls of the gate dielectric layer and a top portion disposed above the topmost surface of the gate dielectric layer. The semiconductor structure further includes a contact feature in direct contact with the top portion of the conductive layer.
1. A semiconductor structure, comprising:
a metal gate structure having a gate dielectric layer and a gate electrode, wherein a topmost surface of the gate dielectric layer is above a topmost surface of the gate electrode;
a conductive layer disposed on the gate electrode, the conductive layer having a bottom portion disposed laterally between sidewalls of the gate dielectric layer and a top portion disposed above the topmost surface of the gate dielectric layer; and
a contact feature in direct contact with the top portion of the conductive layer.
2. The semiconductor structure of claim 1 , wherein the top portion of the conductive layer has a first width, the bottom portion of the conductive layer has a second width, and the first and second widths are substantially the same.
3. The semiconductor structure of claim 1 , wherein the top portion of the conductive layer has a first width, the bottom portion of the conductive layer has a second width, and the first width is greater than the second width.
4. The semiconductor structure of claim 1 , wherein the bottom portion of the conductive layer has a greater vertical height than the top portion of the conductive layer.
5. The semiconductor structure of claim 1 ,
wherein the gate electrode includes a first metal composition, the conductive layer includes a second metal composition,
wherein the bottom portion of the conductive layer includes an interfacial layer having both the first and the second metal compositions.
6. The semiconductor structure of claim 5 ,
wherein the gate electrode includes one or more work function metals surrounding a bulk conductive layer, and the first metal composition include metals of the one or more work function metals or of the bulk conductive layer,
wherein the second metal composition includes metals selected from tungsten (W), cobalt (Co), titanium (Ti), aluminum (Al), copper (Cu), gold (Au), or combinations thereof.
7. The semiconductor structure of claim 6 , wherein the bulk conductive layer includes metals selected from aluminum (Al), copper (Cu), titanium (Ti), tantalum (Ta), tungsten (W), platinum (Pt), molybdenum (Mo), cobalt (Co), silver (Ag), manganese (Mn), zirconium (Zr), ruthenium (Ru), or combinations thereof.
8. The semiconductor structure of claim 1 , wherein the metal gate structure further includes a capping layer disposed between the gate dielectric layer and the gate electrode, wherein the bottom portion of the conductive layer is disposed laterally between sidewalls of the capping layer.
9. The semiconductor structure of claim 8 , wherein the top portion of the conductive layer directly lands on a top surface of the capping layer.
10. A semiconductor structure, comprising:
a metal gate structure having a gate dielectric layer and a gate electrode;
a conductive layer disposed over the metal gate structure, the conductive layer having a bottom portion disposed laterally between sidewalls of the gate dielectric layer and a top portion protruding above a top surface of the gate dielectric layer; and
a contact feature disposed over the conductive layer, wherein the contact feature has a smaller width along a lateral direction than that of the conductive layer.
11. The semiconductor structure of claim 10 , wherein the gate electrode has a smaller width along the lateral direction than that of the conductive layer.
12. The semiconductor structure of claim 10 , wherein the top portion of the conductive layer has a first width, the bottom portion of the conductive layer has a second width, and the first and second widths are substantially the same.
13. The semiconductor structure of claim 10 ,
wherein the top portion of the conductive layer has a first width, the bottom portion of the conductive layer has a second width, and the first width is greater than the second width,
wherein the top portion of the conductive layer lands on a top surface of the gate dielectric layer.
14. The semiconductor structure of claim 10 , wherein a center of the contact feature is vertically offset from a center of the gate electrode.
15. The semiconductor structure of claim 10 , wherein the metal gate structure further includes a capping layer disposed between the gate dielectric layer and the gate electrode, wherein the top portion of the conductive layer lands on a top surface of the capping layer without landing on the gate dielectric layer.
16. A semiconductor structure, comprising:
a metal gate structure having a gate dielectric layer and a gate electrode;
a conductive layer disposed over the metal gate structure, the conductive layer having a bottom portion disposed laterally between sidewalls of the gate dielectric layer and a top portion disposed above the gate dielectric layer; and
a contact feature in direct contact with the top portion of the conductive layer,
wherein the bottom portion of the conductive layer further includes a penetrating portion and a non-penetrating portion, wherein the penetrating portion extends deeper into the gate electrode than the non-penetrating portion.
17. The semiconductor structure of claim 16 ,
wherein the gate electrode includes a first gate metal layer and a second gate metal layer, wherein the first and second gate metal layers include different materials,
wherein the penetrating portion preferentially penetrates into the first gate metal layer without preferentially penetrating into the second gate metal layer.
18. The semiconductor structure of claim 17 , wherein the first gate metal layer is a work function metal layer, and the second gate metal layer is a bulk conductive layer.
19. The semiconductor structure of claim 17 , wherein the first gate metal layer is a bulk conductive layer, and the second gate metal layer is a work function metal layer.
20. The semiconductor structure of claim 16 , wherein a thickness of the conductive layer is greater at a center of the conductive layer than at outer edges of the conductive layer.