CAPILLARY FOR A WIRE BONDING MACHINE HAVING A DYNAMICALLY ADJUSTABLE CHAMFER DIAMETER
A capillary for a wire bonding machine includes a shape memory material. When a stimulant, such as a voltage or heat, is applied to the shape memory material, the capillary changes from a first state to a second state. As the capillary changes from the first state to the second state, a diameter of a chamfer defined by the capillary also changes. During a wire bonding process, the diameter of the chamfer affects a size of a ball formed at the end of a bond wire disposed within the capillary. Thus, the size of the ball may dynamically change based on size parameters of bond pads on which the ball is placed during the wire bonding process.
1 . A capillary for a wire bonder, comprising:
a first portion defining a first chamfer portion, the first chamfer portion having a static diameter; and
a second portion defining a second chamfer portion, the second chamfer portion extending from the first chamfer portion and having a first diameter when the second portion is in a first state and having a second diameter when the second portion is in a second state.
2 . The capillary of claim 1 , wherein a state of the second portion changes from the first state to the second state based, at least in part, on a voltage applied to the second portion.
3 . The capillary of claim 1 , wherein a state of the second portion changes from the first state to the second state based, at least in part, on an amount of heat applied to the second portion.
4 . The capillary of claim 1 , wherein the first portion is comprised of a first material and the second portion is comprised of a shape memory material.
5 . The capillary of claim 4 , wherein the shape memory material includes one or more of a tungsten alloy and a tungsten composite.
6 . The capillary of claim 1 , wherein at least one of the first diameter and the second diameter is based, at least in part, on a bond pad opening on which the capillary forms a wire bond.
7 . The capillary of claim 1 , further comprising an elastomeric material layer provided on the second chamfer portion.
8 . The capillary of claim 1 , wherein the second portion is at least a portion of a tip of the capillary.
9 . A method, comprising:
determining a size parameter associated with a bond pad on a substrate or an integrated circuit; and
applying a stimulant to at least a portion of a capillary of a wire bonder, the stimulant causing the at least the portion of the capillary to change from a first state to a second state.
10 . The method of claim 9 , wherein the stimulant is a voltage.
11 . The method of claim 9 , wherein the stimulant is heat.
12 . The method of claim 9 , wherein the at least the portion of the capillary defines a chamfer and wherein a diameter of the chamfer increases as the at least the portion of the capillary moves from the first state to the second state.
13 . The method of claim 12 , wherein the diameter of the chamfer is based, at least in part, on the size of the bond pad opening.
14 . The method of claim 9 , further comprising forming a ball bond on the bond pad.
15 . The method of claim 9 , wherein the at least the portion of the capillary includes a shape memory material.
16 . The method of claim 15 , wherein the shape memory material includes one or more of a tungsten alloy and a tungsten composite.
17 . The method of claim 9 , wherein the size parameter is one or more of a bond pad opening associated with the bond pad and a bond pad pitch associated with the bond pad.
18 . A wire bonder, comprising:
a bond wire dispensing means defining a chamfer, the chamfer having a first diameter when the wire dispensing means is in a first state and having a second diameter when the wire dispensing means is in a second state; and
a stimulant application means that applies a stimulant to the bond wire dispensing means, the stimulant causing the bond wire dispensing means to change from the first state to the second state.
19 . The wire bonder of claim 18 , wherein the bond wire dispensing means includes one or more of a tungsten alloy and a tungsten composite.
20 . The wire bonder of claim 18 , wherein the stimulant is selected from a group of stimulants comprising:
a voltage; and
heat.