IP Library › Granted Patent US 12,207,511
Granted Patent B2
US 12,207,511 · App. 18/486,207 · Granted Jan 21, 2025

Display device

Inventor: Yasushi Kawata (Tokyo, JP)
Assignee: Japan Display Inc.
H10K59/131H01L27/12H01L27/1218H01L27/1248H10K77/111G02F1/133305G02F1/1345H01L27/1244H10K59/122H10K59/124H10K2102/311Y02E10/549
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,207,511
App. No.
18/486,207
Granted
Jan 21, 2025
Kind
B2
Abstract

According to one embodiment, a display device comprises a flexible substrate, a first insulating film disposed on the flexible substrate, a switching element disposed on the first insulating film, a signal wiring electrically connected with the switching element, a first organic film disposed on the signal wiring, a connection wiring disposed on the first organic film, a second organic film disposed on the connection wiring and a pad electrode disposed on the second organic film. The connection wiring is located between the first organic film and the second organic film and is in contact with the first organic film and the second organic film.

Claims (53)

1. An electronic device comprising:

a flexible substrate including an area where a plurality of switching elements is located;

a first inorganic film located between the flexible substrate and the plurality of switching elements;

wirings supplied with an electrical signal to be transmitted to the plurality of the switching elements; and

pad electrodes supplied with the electrical signal to be supplied to the wirings,

wherein

the wirings are located between the area and the pad electrodes in a plan view,

the wirings are in contact with a first organic film located between the flexible substrate and the wirings,

the first organic film is in contact with a surface of the flexible substrate between the area and the pad electrodes,

the flexible substrate is bent between the area and the pad electrodes so that the pad electrodes are located under the area,

the first inorganic film includes a first part and a second part separated from the first part,

the first part is located between the flexible substrate and the plurality of switching elements in a sectional view, and

the second part is located between the flexible substrate and the pad electrodes in the sectional view.

2. An electronic device comprising:

a flexible substrate including an area where a plurality of switching elements is located;

a first inorganic film located between the flexible substrate and the plurality of switching elements;

wirings supplied with an electrical signal to be transmitted to the plurality of the switching elements;

pad electrodes supplied with the electrical signal to be supplied to the wirings;

a second inorganic film provided on a semiconductor layer of the switching elements; and

a third inorganic film provided on a gate electrode of the switching elements,

wherein

the wirings are located between the area and the pad electrodes in a plan view,

the wirings are in contact with a first organic film located between the flexible substrate and the wirings,

the first organic film is in contact with a surface of the flexible substrate between the area and the pad electrodes,

the flexible substrate is bent between the area and the pad electrodes so that the pad electrodes are located under the area,

the second inorganic film and the third inorganic film include a third part and a fourth part separated from the third part,

the third part is located between the flexible substrate and the plurality of switching elements in a sectional view, and

the fourth part is located between the flexible substrate and the pad electrodes in the sectional view.

3. An electronic device comprising:

a flexible substrate including an area where a plurality of switching elements is located;

a first inorganic film located between the flexible substrate and the plurality of switching elements;

wirings supplied with an electrical signal to be transmitted to the plurality of the switching elements;

pad electrodes supplied with the electrical signal to be supplied to the wirings;

a second inorganic film provided on a semiconductor layer of the switching elements; and

a third inorganic film provided on a gate electrode of the switching elements, wherein

the wirings are located between the area and the pad electrodes in a plan view,

the wirings are in contact with a first organic film located between the flexible substrate and the wirings,

the first organic film is in contact with a surface of the flexible substrate between the area and the pad electrodes,

the flexible substrate is bent between the area and the pad electrodes so that the pad electrodes are located under the area, and

the first inorganic film, the second inorganic film, and the third inorganic film are not provided between the area and the pad electrodes.

4. The electronic device according to claim 1 , further comprising:

a second inorganic film provided on a semiconductor layer of the switching elements; and

a third inorganic film provided on a gate electrode of the switching elements.

5. The electronic device according to claim 4 , wherein

the second inorganic film and the third inorganic film include a third part and a fourth part separated from the third part,

the third part is located between the first part and the plurality of switching elements in a sectional view, and

the fourth part is located between the second part and the pad electrodes in the sectional view.

6. The electronic device according to claim 4 , wherein

the first inorganic film, the second inorganic film, and the third inorganic film are not provided between the area and the pad electrodes.

7. The electronic device according to claim 1 , wherein

a part of the first organic film is located between the first part and the wirings.

8. The electronic device according to claim 7 ,

wherein a thickness of the first organic film between the first part and the second part is larger than a thickness of the part of first organic film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2023
From: KAWATA, YASUSHI
To: JAPAN DISPLAY INC.
Reel/Frame 065206/0805 →
Priority Claims (1)
JP 2016-075331 · Apr 4, 2016 · national
Continuity (6)
Continuation 17876733 · Jul 29, 2022
Continuation 17113513 · Dec 7, 2020
Continuation 16788830 · Feb 12, 2020
Continuation 16504943 · Jul 8, 2019
Continuation 15478400 · Apr 4, 2017
Related Publication 20240065060A1 · Feb 22, 2024
References Cited (33)
US 7733456B2 · Lee · 2010 [cited by applicant]
US 9276055B1 · Son et al. · 2016 [cited by applicant]
US 20050112805A1 · Goto et al. · 2005 [cited by applicant]
US 20110090436A1 · Choi et al. · 2011 [cited by applicant]
US 20120146886A1 · Tesuo et al. · 2012 [cited by applicant]
US 20140049449A1 · Park · 2014 [cited by examiner]
US 20140145153A1 · Kim et al. · 2014 [cited by applicant]
US 20140217397A1 · Kwak et al. · 2014 [cited by applicant]
US 20140254111A1 · Yamazaki et al. · 2014 [cited by applicant]
US 20140353670A1 · Youn · 2014 [cited by examiner]
US 20140354143A1 · Jung et al. · 2014 [cited by applicant]
US 20140367658A1 · Kwak · 2014 [cited by applicant]
US 20150179728A1 · Kwon et al. · 2015 [cited by applicant]
US 20150221683A1 · Kazuhiro et al. · 2015 [cited by applicant]
US 20160181282A1 · Kazuhiro et al. · 2016 [cited by applicant]
US 20160218305A1 · Kim et al. · 2016 [cited by applicant]
US 20170117346A1 · Kim · 2017 [cited by applicant]
US 20170176827A1 · Kawata et al. · 2017 [cited by applicant]
US 20170262109A1 · Choi et al. · 2017 [cited by applicant]
US 20170288007A1 · Shin et al. · 2017 [cited by applicant]
US 20170309651A1 · Kim et al. · 2017 [cited by applicant]
US 20170315399A1 · Kwon et al. · 2017 [cited by applicant]
US 20190148413A1 · Kim et al. · 2019 [cited by applicant]
CN 1636030A · 2005 [cited by applicant]
JP 5720222B2 · 2015 [cited by applicant]
JP 2015148728A · 2015 [cited by applicant]
KR 1020140129647A · 2014 [cited by applicant]
Japanese Office Action issued on Mar. 3, 2020, in Patent Application No. 2016-07533.1, 6 pages (submitting unedited computer generated English translation only). [cited by applicant]
English translation of the Combined Chinese Office Action and Searcl1 Report issued on Mar. 3, 2020, in Patent Application No. 201710206364.9, 10 pages. [cited by applicant]
Office Action issued Sep. 2, 2020, in Cilinese Patent Application No. 201710206364.9, (Machine English Translation). [cited by applicant]
Notification of Reexamination issued Aug. 23, 2021 in Chinese Application ND. 201710206364.9, 4 pages. [cited by applicant]
Reexamination Decision issued Oct. 28, 2021 in Chinese Application No. 201710206364.9, 9 pages. [cited by applicant]
Office Action issued Dec. 2, 2020 in corresponding Chinese Patent Application No. 201710206364.9, 4 pages. [cited by applicant]