MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.
1 . A stencil for depositing solder on a printed circuit board (PCB), the stencil comprising:
a plurality of stencil apertures, a first stencil aperture of the plurality of stencil apertures having an aperture wall defining an aperture perimeter,
wherein the aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the PCB,
wherein the aperture wall is configured to not extend beyond an outer edge of a terminal of a surface mount component, and
wherein the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.
2 . The stencil of claim 1 , wherein the non-convex solder joint is a concave solder joint.
3 . The stencil of claim 1 , wherein the non-convex solder joint is a straight solder joint.
4 . The stencil of claim 1 , wherein a maximum principal stress level exerted by the non-convex solder joint is less than or equal to 42 megapascal (MPa).
5 . The stencil of claim 4 , wherein the non-convex solder joint is a concave solder joint, wherein the maximum principal stress level exerted by the concave solder joint is approximately equal to 30 MPa.
6 . The stencil of claim 1 , wherein a portion of the aperture perimeter defined by the aperture wall has a width of approximately 0.2 millimeters (mm).
7 . The stencil of claim 1 , wherein the surface mount component is a quad flat no-lead (QFN) package.
8 . The stencil of claim 1 , wherein the first stencil aperture is configured to receive the solder paste that contacts the PCB pad and only a surface of the terminal that faces the PCB pad.