Radiation imaging apparatus comprising a fluorescent member, a flexible substrate, a support base, a control board, and an interposed member between the flexible substrate and the support base
A radiation imaging apparatus includes a radiation detection sensor, a support base, a bonding member, and a wiring member. The radiation detection sensor is configured to detect radiation and is formed using a flexible substrate. The support base supports radiation detection sensor. The bonding member bonds a first region of the radiation detection sensor to the support base. The first region is located in a central portion of the radiation detection sensor. The wiring member is connected to a predetermined edge portion of the radiation detection sensor. A second region is a region of the radiation detection sensor that includes the predetermined edge portion, and the second region opposes the support base but is not adhered to the support base.
1 . A radiation imaging apparatus comprising:
a radiation detection sensor including a flexible substrate configured to detect radiation;
a support base supporting the radiation detection sensor;
a bonding member that bonds a first region of the radiation detection sensor to the support base, the first region being located in a central portion of the radiation detection sensor; and
a wiring member connected to a predetermined edge portion of the radiation detection sensor,
wherein a second region is a region of the radiation detection sensor that includes the predetermined edge portion, and
wherein the second region opposes the support base but is not adhered to the support base.
2 . The radiation imaging apparatus according to claim 1 , further comprising:
a holding mechanism holding opposite surfaces of the second region of the radiation detection sensor.
3 . The radiation imaging apparatus according to claim 2 ,
wherein the holding mechanism includes
a first abutting member abutting a surface of the radiation detection sensor, the surface facing the support base, and
a second abutting member abutting a surface of the radiation detection sensor, the surface being opposite to the surface facing the support base.
4 . The radiation imaging apparatus according to claim 3 ,
wherein the first abutting member is fixed to the support base.
5 . The radiation imaging apparatus according to claim 3 ,
wherein the first abutting member is not fixed to the support base.
6 . The radiation imaging apparatus according to claim 3 , further comprising:
a housing accommodating the radiation detection sensor, the support base, the bonding member, and the wiring member, the housing including a top member through which radiation is incident on the radiation detection sensor,
wherein the second abutting member is fixed to the top member.
7 . The radiation imaging apparatus according to claim 3 , further comprising
a housing accommodating the radiation detection sensor, the support base, the bonding member, and the wiring member, the housing including a top member through which radiation is incident on the radiation detection sensor,
wherein the second abutting member is not fixed to the top member.
8 . The radiation imaging apparatus according to claim 3 ,
wherein the first abutting member is made of a metal, a resin, or a foamed material.
9 . The radiation imaging apparatus according to claim 8 ,
wherein the first abutting member has a rigidity higher than that of the second abutting member.
10 . The radiation imaging apparatus according to claim 3 ,
wherein the second abutting member is made of a metal, a resin, or a foamed material.
11 . The radiation imaging apparatus according to claim 3 ,
wherein the second abutting member is an elastic member pressing the radiation detection sensor toward the first abutting member.
12 . The radiation imaging apparatus according to claim 1 ,
further comprising: a scintillator layer is formed on one of opposite surfaces of the radiation detection sensor, but the scintillator layer is not formed in the second region.
13 . The radiation imaging apparatus according to claim 1 ,
the bonding member includes multiple layers.
14 . The radiation imaging apparatus according to claim 1 ,
the flexible substrate is a thin plastic film.
15 . The radiation imaging apparatus according to claim 1 ,
the wiring member is a chip-on-film (COF) device.