Hall effect sensor with low offset and high level of stability
A magnetic field magnetic field sensor and method of making the sensor. The sensor and method of making the sensor may comprise a material or structure that prevents the admission of light in certain wavelengths to enhance the stability of the magnetic field sensor over a period of time. The sensor and method of making the sensor may comprise an adsorption prevention layer which protects the semiconductor portion of the magnetic. The sensor may also comprise an insulating layer formed between semiconductor layers and a substrate layer.
1. A magnetic field sensor comprising:
a first semiconductor layer comprising a first semiconductor;
a second semiconductor layer comprising a second semiconductor exhibiting a bandgap that is greater than a bandgap of the first semiconductor;
a third semiconductor layer comprising a third semiconductor;
a covering that reduces the excitation of defect states caused by the exposure of at least one of the first semiconductor layer and the second semiconductor layer to visible or ultraviolet light.
2. The sensor of claim 1 , wherein the covering comprises a material that reflects visible or ultraviolet light.
3. The sensor of claim 1 , wherein the covering comprises a material that absorbs visible or ultraviolet light.
4. The sensor of claim 1 , wherein the covering reduces the exposure of the semiconductor layers to light with wavelengths in the range of 80 nm to 800 nm.
5. The sensor of claim 1 , wherein the first semiconductor comprises gallium nitride, the second semiconductor comprises aluminum gallium nitride, and the third semiconductor comprises aluminum nitride.
6. The sensor of claim 1 , wherein a stability of an offset voltage absolute value is improved by at least 38 percent over a period of time of 10 hours when compared to a stability of an offset voltage absolute value over a period of time of 10 hours for the magnetic field sensor without the covering applied to the magnetic field sensor.
7. The sensor of claim 1 , further comprising:
a treatment layer applied to at least a portion of the first semiconductor or the second semiconductor;
wherein the magnetic field sensor is characterized by an offset voltage absolute value less than an untreated offset voltage absolute value associated with the first low bandgap semiconductor layer and the intermediate bandgap semiconductor layer without the treatment layer, when the magnetic field sensor is exposed to ionic contaminants.
8. The sensor of claim 7 , wherein the treatment layer reduces adsorption of ionic contaminants.
9. The sensor of claim 7 , wherein the treatment layer is a passivation layer.
10. The sensor of claim 7 , wherein the treatment layer is formed from SiNx with a thickness of at least 2 nm.
11. The sensor of claim 7 , wherein the first semiconductor comprises gallium nitride and the second semiconductor comprises aluminum gallium nitride.
12. The sensor of claim 7 , further comprising:
a high bandgap semiconductor layer comprising a third semiconductor, the third semiconductor exhibiting a greater bandgap than the second semiconductor; and
a second low bandgap semiconductor layer comprising the first semiconductor.
13. The sensor of claim 12 , wherein the first semiconductor comprises gallium nitride and the second semiconductor comprises aluminum gallium nitride.
14. The sensor of claim 13 , wherein the third semiconductor comprises aluminum nitride.
15. The sensor of claim 7 , wherein the offset voltage absolute value is at least 25 percent less than the untreated offset voltage absolute value of the sensor if untreated.
16. A method of forming a magnetic field sensor comprising:
providing a substrate;
forming a first low bandgap semiconductor layer comprising a first semiconductor on the substrate;
forming a second semiconductor layer comprising a second semiconductor exhibiting a bandgap that is greater than the first semiconductor;
forming a third semiconductor layer comprising a third semiconductor exhibiting a bandgap that is greater than the first semiconductor; and
forming a protective layer to the magnetic field sensor.
17. The method of claim 16 , wherein the protective layer is a covering applied to the magnetic field sensor that reduces the excitation of defect states found in the magnetic sensor caused by the exposure of the first low bandgap semiconductor layer and the second semiconductor layer to visible or ultraviolet light.
18. The method of claim 17 , wherein the covering reduces the exposure of the first low bandgap semiconductor layer, the second semiconductor layer, and the third semiconductor layer to light with wavelengths in the range of 80 nm to 800 nm.
19. The method of claim 16 , wherein the protective layer comprises a treatment layer which reduces adsorption of ionic contaminants applied to at least a portion of the first semiconductor or the second semiconductor.
20. The method of claim 19 , wherein the treatment layer is formed from SiNx with a thickness of at least 2 nm.