3D glass modules
A hermetic glass module for wireless communication. The module may comprise a plurality of glass layers comprising a first layer having capacitors, inductors, and resonators, a second layer comprising capacitors, inductors, diplexers, and waveguides, a third layer comprising microchips, and capacitors, and a fourth layer comprising a glass cover layer, and antennas disposed within the glass cover layer. The plurality of glass layers may each be separated by a substrate of a plurality of substrates and are connected by a redistribution layer (RDL) of a plurality of RDLs.
1 . A three-dimensional glass module ( 10 ) comprising: a. a plurality of glass substrates comprising: i. a first glass substrate ( 11 ); ii. a second glass substrate ( 12 ) bonded to the first glass substrate ( 11 ) by a first redistribution layer, comprising one or more electronic components ( 15 ); and iii. a third glass substrate ( 13 ) bonded to the second glass substrate ( 12 ) by a second redistribution layer; wherein the first glass substrate ( 11 ) comprises one or more slots ( 41 ) configured to expose at least a portion of the one or more electronic components ( 15 ) and one or more lateral vias disposed in the one or more slots, such that the one or more electronic components ( 15 ) are accessible from a side or a top of the first glass substrate ( 11 ) through the one or more lateral vias; and wherein the third glass substrate ( 13 ) is configured to fit into a mountable carrier substrate.
2 . The module ( 10 ) of claim 1 , wherein the first glass substrate ( 11 ) comprises one or more holes ( 21 ), wherein the second glass substrate ( 12 ) comprises one or more holes ( 22 ), wherein the third glass substrate ( 13 ) comprises one or more holes ( 23 ), wherein the one or more holes ( 21 ) of the first glass substrate ( 11 ), the one or more holes ( 22 ) of the second glass substrate ( 12 ), and the one or more holes ( 23 ) of the third glass substrate ( 13 ) align and are filled with a conductive material.
3 . The module ( 10 ) of claim 2 , wherein the conductive material comprises copper.
4 . The module ( 10 ) of claim 1 , wherein the one or more electronic components ( 15 ) comprise a capacitor, an inductor, or a combination thereof.
5 . The module ( 10 ) of claim 4 , wherein the capacitor, the inductor, or the combination thereof are disposed within two or more glass substrates of the plurality of glass substrates.
6 . The module ( 10 ) of claim 1 , wherein the first glass substrate ( 11 ), the third glass substrate ( 13 ), or a combination thereof are configured to attach to one or more additional glass modules ( 30 ), each additional glass module of the one or more additional glass modules ( 30 ) comprising one or more additional electronic components ( 31 ).
7 . The module ( 10 ) of claim 6 , wherein the one or more electronic components ( 15 ) of the module ( 10 ) are configured to communicate with the one or more additional electronic components ( 31 ) through radiofrequency (RF) communication.
8 . The module ( 10 ) of claim 1 , wherein the carrier substrate comprises ceramic, organic material, or a combination thereof.
9 . A three-dimensional glass module ( 10 ) comprising: a. a plurality of glass substrates comprising: i. a first glass substrate ( 11 ) comprising one or more holes ( 21 ); ii. a second glass substrate ( 12 ) bonded to the first glass substrate ( 11 ) by a first redistribution layer, comprising one or more electronic components ( 15 ) and one or more holes ( 22 ); and iii. a third glass substrate ( 13 ) bonded to the second glass substrate ( 12 ) by a second redistribution layer, comprising one or more holes ( 23 ); wherein the one or more holes ( 21 ) of the first glass substrate ( 11 ), the one or more holes ( 22 ) of the second glass substrate ( 12 ), and the one or more holes ( 23 ) of the third glass substrate ( 13 ) align and are filled with a conductive material; wherein the first glass substrate ( 11 ) comprises one or more slots ( 41 ) configured to expose at least a portion of the one or more electronic components ( 15 ) and one or more lateral vias disposed in the one or more slots, such that the one or more electronic components ( 15 ) are accessible from a side or a top of the first glass substrate ( 11 ) through the one or more lateral vias; and wherein the third glass substrate ( 13 ) is configured to fit into a mountable carrier substrate.
10 . The module ( 10 ) of claim 9 , wherein the one or more electronic components ( 15 ) comprise a capacitor, an inductor, or a combination thereof.
11 . The module ( 10 ) of claim 10 , wherein the capacitor, the inductor, or the combination thereof are disposed within two or more glass substrates of the plurality of glass substrates.
12 . The module ( 10 ) of claim 9 , wherein the first glass substrate ( 11 ), the third glass substrate ( 13 ), or a combination thereof are configured to attach to one or more additional glass modules ( 30 ), each additional glass module of the one or more additional glass modules ( 30 ) comprising one or more additional electronic components ( 31 ).
13 . The module ( 10 ) of claim 12 , wherein the one or more electronic components ( 15 ) of the module ( 10 ) are configured to communicate with the one or more additional electronic components ( 31 ) through radiofrequency (RF) communication.
14 . A three-dimensional glass module ( 10 ) comprising: a. a plurality of glass substrates comprising: i. a first glass substrate ( 11 ) comprising one or more holes ( 21 ); ii. a second glass substrate ( 12 ) bonded to the first glass substrate ( 11 ) by a first redistribution layer, comprising one or more electronic components ( 15 ) comprising a capacitor, an inductor, or a combination thereof, and one or more holes ( 22 ); and iii. a third glass substrate ( 13 ) bonded to the second glass substrate ( 12 ) by a second redistribution layer, comprising one or more holes ( 23 ); wherein the one or more holes ( 21 ) of the first glass substrate ( 11 ), the one or more holes ( 22 ) of the second glass substrate ( 12 ), and the one or more holes ( 23 ) of the third glass substrate ( 13 ) align and are filled with a conductive material; wherein the capacitor, the inductor, or the combination thereof are disposed across two or more glass substrates of the plurality of glass substrates; wherein the first glass substrate ( 11 ), the third glass substrate ( 13 ), or a combination thereof are configured to attach to one or more additional glass modules ( 30 ), each additional glass module of the one or more additional glass modules ( 30 ) comprising one or more additional electronic components ( 31 ); wherein the one or more electronic components ( 15 ) of the module ( 10 ) are configured to communicate with the one or more additional electronic components ( 31 ) through radiofrequency (RF) communication; wherein the first glass substrate ( 11 ) comprises one or more slots ( 41 ) configured to expose at least a portion of the one or more electronic components ( 15 ) and one or more lateral vias disposed in the one or more slots, such that the one or more electronic components ( 15 ) are accessible from a side or a top of the first glass substrate ( 11 ) through the one or more lateral vias; and wherein the third glass substrate ( 13 ) is configured to fit into a mountable carrier substrate.