Heat sink for electronic component and associated manufacturing method
A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is made of a material based on a metal and the surface layer is made of an oxide of said material. The outer layer includes juxtaposed nodules. The heat sink originally combines a surface chemical state promoting heat emission and a structure geometrically promoting heat exchange, in order to synergistically improve its heat dissipation capability.
1 . A heat sink for an electronic component comprising:
a body provided with an outer layer, comprising a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer, wherein:
the underlying layer is made of a material made of a metal or of a metal alloy and the surface layer is made of an oxide of said material;
the outer layer comprises juxtaposed nodules which are separated by an inter-nodular zone; and
a shape of the nodules is generally cylindrical.
2 . The heat sink as claimed in claim 1 , wherein the metal is selected from among magnesium, iron, steel, copper and aluminum.
3 . The heat sink as claimed in claim 2 , wherein the metal is aluminum and the oxide is alumina.
4 . The heat sink as claimed in claim 1 , wherein the surface layer has an average thickness that is greater than or equal to 5 μm.
5 . The heat sink as claimed claim 1 , wherein the surface layer has an average thickness ranging between 5 μm and 30 μm.
6 . The heat sink as claimed claim 1 , wherein the surface layer has a porosity rate by volume of less than 4%.
7 . The heat sink as claimed in claim 1 , wherein each nodule has a variable cross-sectional shape over a height of this nodule.
8 . The heat sink as claimed in claim 1 , wherein the nodules on average have:
a first dimension in a direction parallel to a main extension plane of the outer layer that is less than or equal to 50 μm;
a second dimension in a direction normal to the main extension plane of the outer layer that is less than or equal to 50 μm.
9 . The heat sink as claimed in claim 1 , wherein the nodules are spaced apart from each other by an average distance, in a direction parallel to a main extension plane of the outer layer, that is less than or equal to 50 μm.
10 . The heat sink as claimed in claim 1 , wherein the nodules are formed by a combination of the surface layer and of at least a portion of the underlying layer.
11 . The heat sink as claimed in claim 2 , wherein the surface layer has an average thickness that is greater than or equal to 5 μm.
12 . The heat sink as claimed claim 2 , wherein the surface layer has an average thickness ranging between 5 μm and 30 μm.
13 . The heat sink as claimed in claim 9 , wherein the average distance is approximately 10 μm to approximately 50 μm.