Multi-die package structures including redistribution layers
A semiconductor device and a method of making the same are provided. A first die and a second die are placed over a carrier substrate. A first molding material is formed adjacent to the first die and the second die. A first redistribution layer is formed overlying the first molding material. A through via is formed over the first redistribution layer. A package component is on the first redistribution layer next to the copper pillar. The package component includes a second redistribution layer. The package component is positioned so that it overlies both the first die and the second die in part. A second molding material is formed adjacent to the package component and the first copper pillar. A third redistribution layer is formed overlying the second molding material. The second redistribution layer is placed on a substrate and bonded to the substrate.
1 . A semiconductor assembly, comprising:
a first redistribution structure;
an interposer over the first redistribution structure;
a first molding material extending along a first sidewall of the interposer;
a first conductive via laterally spaced apart from the first sidewall of the interposer and extending through the first molding material;
a second redistribution structure over the interposer and the first conductive via;
a first die over and attached to the second redistribution structure;
a second die over and attached to the second redistribution structure, the second die laterally spaced apart from the first die, and
a second molding material extending between the first die and the second die;
and the first die and the second die each partially overlapping the interposer so that the interposer underlies each of the first and second die in part,
wherein a first sidewall of the first die is opposite to a surface of the first die that faces the second die, and a first sidewall of the second die is opposite to a surface of the second die that faces the first die;
wherein a sidewall of the interposer that is closest to the first sidewall of the first die is offset from the first sidewall of the first die, and a sidewall of the interposer that is closest to the first sidewall of the second die is offset from the first sidewall of the second die;
a third die and a second interposer, wherein the third die is positioned over the second redistribution structure and next to the second die, and wherein the second interposer is positioned so that it underlies the second redistribution structure and each of the second die and the third die in part.
2 . The semiconductor assembly of claim 1 , wherein the interposer comprises a silicon substrate.
3 . The semiconductor assembly of claim 1 , wherein the interposer interconnects the first and second dies.
4 . The semiconductor assembly of claim 1 wherein the second molding material overlies the second redistribution structure.
5 . The semiconductor assembly of claim 1 , further comprising a substrate underlying and attached to the first redistribution structure.
6 . The semiconductor assembly of claim 5 further comprising a heat dissipation lid on the substrate, wherein the first die, the second die and the interposer are disposed in an inner cavity of the heat dissipation lid.
7 . The semiconductor assembly of claim 1 , wherein the first molding material laterally surrounds the interposer and the first conductive via, and wherein the first molding material extends from the first redistribution structure to the second redistribution structure.
8 . A semiconductor assembly, comprising:
a first redistribution structure;
a first interposer over the first redistribution structure;
a first conductive via laterally spaced apart from the first interposer;
a second conductive via laterally spaced apart from the first interposer, the first interposer being disposed between the first conductive via and the second conductive via;
a molding material above the first redistribution structure, the molding material being between the first conductive via and the first interposer, the molding material being between the first interposer and the second conductive via;
a second redistribution structure above the first conductive via, the second conductive via, the molding material, and the first interposer;
a first die over and attached to the second redistribution structure, the first die overlapping the first interposer;
a second die over and attached to the second redistribution structure and laterally spaced apart from the first die, the second die overlapping the first interposer, the first interposer underlying both the first and second dies in part; and
a third die and a second interposer, wherein the third die is positioned over the second redistribution structure and next to the second die, and wherein the second interposer is positioned so that it underlies the second redistribution structure and each of the second die and the third die in part.
9 . The semiconductor assembly of claim 8 , wherein the molding material physically contacts the first conductive via, the second conductive via, and the first interposer die.
10 . The semiconductor assembly of claim 8 , wherein the first second die overlaps the first conductive via.
11 . The semiconductor assembly of claim 10 , wherein the second third die overlaps the second conductive via.
12 . The semiconductor assembly of claim 8 , wherein the first interposer interconnects the first and second dies.
13 . The semiconductor assembly of claim 8 further comprising a plurality of solder connectors on a bottom surface of the first redistribution structure.
14 . A semiconductor assembly, comprising:
a first redistribution structure;
a first interposer over the first redistribution structure;
a first conductive via;
a second conductive via, the first interposer being disposed between the first conductive via and the second conductive via;
a second interposer over the first redistribution structure;
a second redistribution structure above the first conductive via, the second conductive via, and the first and second interposers,
a molding material between the first and second redistribution structures, wherein the first conductive via extends through the molding material, and wherein the second conductive via extends through the molding material;
a first die over the second redistribution structure;
a second die over the second redistribution structure, the second die laterally spaced apart from a first lateral side of the first die and overlapping the first interposer; and
a third die over the second redistribution structure, the third die laterally spaced apart from a second lateral side of the first die opposing the first lateral side, the third die overlapping the second interposer;
wherein the first interposer underlies in part the first die and the second die; and
wherein the second interposer underlies in part the first die and the third die.
15 . The semiconductor assembly of claim 14 , the molding material encapsulating the first interposer, the second interposer, the first conductive via, and the second conductive via.
16 . The semiconductor assembly of claim 14 , further comprising a second molding material disposed between the first die, the second die and the third die.
17 . The semiconductor assembly of claim 14 , wherein the first interposer interconnects the first die and the second die and the second interposer interconnects the first die and the third die.
18 . The semiconductor assembly of claim 17 , wherein the second die is one of a plurality of stacked memory dies and the first die is a logic die.
19 . The semiconductor assembly of claim 18 , wherein the third die is one of a plurality of stacked memory dies.