IP Library › Granted Patent US 12,366,387
Granted Patent B2
US 12,366,387 · App. 18/649,321 · Granted Jul 22, 2025

Integrated dilution refrigerators

Inventors: Corban I. Tillemann-Dick (Denver, CO); Kyle J. Thompson (Boulder, CO); Bryan J. Choo (New York, NY)
Assignee: Maybell Quantum Industries, Inc.
F25B9/12F25B9/10F25B9/145F25B25/005F25D19/006H05K7/208B33Y80/00F25B2500/13H05K7/20827
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Quick Facts
Patent No.
US 12,366,387
App. No.
18/649,321
Granted
Jul 22, 2025
Kind
B2
Abstract

A distributed refrigeration system is provided. The distributed refrigeration system comprises a pre-cooling system configured to be thermally coupled to two or more cryogenic devices and to provide a first cooling stage to the two or more cryogenic devices. The two or more cryogenic devices may be two or more of a dilution refrigerator, a low-temperature microscopy system, a 3 He refrigeration system, and/or a superconducting CMOS system.

Claims (27)

1. A distributed refrigeration system comprising:

a pre-cooling system configured to be, during operation of the distributed refrigeration system, thermally coupled to first and second cryogenic devices and to provide first cooling stages to the first and second cryogenic devices, the first cooling stages being cooled to a first temperature, wherein:

the first cryogenic device is disposed in a first outer vacuum chamber; and

the second cryogenic device is disposed in a second outer vacuum chamber separate from the first outer vacuum chamber.

2. The distributed refrigeration system of claim 1 , further comprising the first and second cryogenic devices thermally coupled to the pre-cooling system.

3. The distributed refrigeration system of claim 1 , wherein the first and/or second cryogenic devices comprise a dilution refrigerator.

4. The distributed refrigeration system of claim 1 , wherein the first and/or second cryogenic devices comprise one or more of a dilution refrigerator, a low-temperature microscopy system, a 3 He refrigeration system, and/or a superconducting CMOS system.

5. The distributed refrigeration system of claim 1 , wherein the first temperature is less than or equal to 5 K.

6. The distributed refrigeration system of claim 5 , wherein the pre-cooling system comprises a cryocooling system.

7. The distributed refrigeration system of claim 6 , wherein the cryocooling system comprises a pulse tube.

8. The distributed refrigeration system of claim 6 , wherein the cryocooling system comprises a Brayton cryocooler.

9. The distributed refrigeration system of claim 6 , wherein the cryocooling system comprises a helium liquefier system.

10. The distributed refrigeration system of claim 5 , wherein the first and/or second cryogenic device comprises a dilution refrigerator having a second cooling stage configured to reach a temperature less than or equal to 1 K.

11. The distributed refrigeration system of claim 10 , wherein the second cooling stage is configured to reach a temperature less than or equal to 100 mK.

12. The distributed refrigeration system of claim 1 , wherein the distributed refrigeration system is configured to be integrated into one or more server racks.

13. The distributed refrigeration system of claim 12 , wherein:

the pre-cooling system is integrated into a first server rack, and

the first and second cryogenic devices are integrated into second server racks different than the first server rack.

14. The distributed refrigeration system of claim 12 , wherein:

the pre-cooling system is integrated into a first server rack, and

the first and/or second cryogenic device comprises a dilution refrigerator, wherein the dilution refrigerator is integrated into a second server rack different than the first server rack.

15. The distributed refrigeration system of claim 1 , further comprising thermal coupling components configured to, during operation of the distributed refrigeration system, transfer heat from the first and/or second cryogenic devices to the pre-cooling system.

16. The distributed refrigeration system of claim 15 , wherein the thermal coupling components comprise one or more fill lines.

17. The distributed refrigeration system of claim 15 , wherein the thermal coupling components comprise one or more heat pipes.

18. The distributed refrigeration system of claim 17 , wherein the one or more heat pipes comprise one or more pulsed heat pipes.

19. The distributed refrigeration system of claim 15 , wherein the thermal coupling components comprise a superfluid loop.

20. The distributed refrigeration system of claim 15 , wherein the thermal coupling components comprise one or more vacuum insulated pipes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2024
From: TILLEMANN-DICK, CORBAN I.; THOMPSON, KYLE J.; CHOO, BRYAN J.
To: MAYBELL QUANTUM INDUSTRIES, INC.
Reel/Frame 068112/0100 →
Continuity (4)
Continuation 17861026 · Jul 8, 2022
Provisional Application 63319248 · Mar 11, 2022
Provisional Application 63219795 · Jul 8, 2021
Related Publication 20240295348A1 · Sep 5, 2024
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