Structure and method for FinFET device with asymmetric contact
The present disclosure provides one embodiment of a method of forming an integrated circuit structure. The method includes forming a shallow trench isolation (STI) structure in a semiconductor substrate of a first semiconductor material, thereby defining a plurality of fin-type active regions separated from each other by the STI structure; forming gate stacks on the fin-type active regions; forming an inter-layer dielectric (ILD) layer filling in gaps between the gate stacks; patterning the ILD layer to form a trench between adjacent two of the gate stacks; depositing a first dielectric material layer that is conformal in the trench; filling the trench with a second dielectric material layer; patterning the second dielectric material layer to form a contact opening; and filling a conductive material in the contact opening to form a contact feature.
1 . A semiconductor structure, comprising:
a gate stack disposed on an active region of a substrate;
a gate spacer covering a sidewall of the gate stack;
a source/drain feature on the substrate;
a contact feature landing on the source/drain feature;
a dielectric feature disposed between the gate spacer and contact feature, the dielectric feature being in direct contact with a sidewall and a top surface of the gate spacer; and
a dielectric hard mask disposed on the gate stack, the dielectric feature overlying the dielectric hard mask.
2 . The semiconductor structure of claim 1 , wherein
the gate spacer includes a first dielectric material;
the dielectric feature includes a second dielectric material; and
the second dielectric material is different from the first dielectric material in composition.
3 . The semiconductor structure of claim 2 , wherein
the dielectric hard mask includes a third dielectric material different from the first and second dielectric materials in composition; and
the dielectric feature overlaps the top surface of the gate spacer.
4 . The semiconductor structure of claim 3 , further comprising a fourth dielectric material, wherein
the contact feature includes a first sidewall extending in parallel with the gate spacer and a second sidewall extending away from the gate spacer;
the dielectric feature is disposed on a first sidewall of the contact feature and free from the second sidewall of the contact feature;
the fourth dielectric material is disposed on the second sidewall of the contact feature and is free from the first sidewall of the contact feature; and
the fourth dielectric material is different from the second dielectric material layer.
5 . The semiconductor structure of claim 4 , further comprising
a second gate stack disposed partially on a first end of the active region and partially on a STI feature; and
a third gate stack disposed partially on a second end of the active region and partially on the STI feature.
6 . The semiconductor structure of claim 1 , wherein the contact feature has an elongated shape with an L/W ratio defined as its length over its width, and wherein the L/W ratio is greater than 2.
7 . The semiconductor structure of claim 1 , wherein the dielectric feature has a loop structure enclosing the contact feature.
8 . The semiconductor structure of claim 1 , wherein the dielectric feature is recessed from the contact feature such that a top surface of the dielectric feature is below a top surface of the contact feature.
9 . A semiconductor structure, comprising:
a fin extending from a substrate along a first direction;
a gate stack disposed on the fin and extending along a second direction substantially perpendicular to the first direction;
a gate spacer covering a sidewall of the gate stack;
a dielectric hard mask disposed on a top surface of the gate stack;
a source/drain feature disposed on the fin and adjacent to the gate stack;
a contact feature landing on the source/drain feature, and the contact feature including a first sidewall extending along the second direction and a second sidewall extending along the first direction;
a first dielectric layer disposed between the gate spacer and contact feature, the first dielectric layer being in direct contact with a sidewall of the gate spacer and the first sidewall of the contact feature, the first dielectric layer being free from the second sidewall of the contact feature; and
a second dielectric layer disposed over the dielectric hard mask and overlying a top surface of the gate spacer and the first dielectric layer.
10 . The semiconductor structure of claim 9 further comprising a third dielectric layer adjacent to and contacting the second sidewall of the contact feature, wherein the first dielectric layer is disposed between the gate spacer and the third dielectric layer.
11 . The semiconductor structure of claim 9 wherein the first sidewall of the contact feature is longer than the second sidewall of the contact feature.
12 . The semiconductor structure of claim 9 wherein the gate spacer is composed of a first dielectric material and the first dielectric layer is composed of a second dielectric material different from the first dielectric material.
13 . The semiconductor structure of claim 12 wherein the first dielectric material is a semiconductor oxynitride.
14 . The semiconductor structure of claim 12 wherein the second dielectric material is a silicon nitride.
15 . The semiconductor structure of claim 9 wherein the first dielectric layer has a thickness ranging between 5 and 30 angstroms.
16 . The semiconductor structure of claim 9 wherein the first dielectric layer has a thickness of 30 angstroms.
17 . The semiconductor structure of claim 9 wherein the gate spacer is composed of two or more layers.
18 . A semiconductor structure, comprising:
a fin extending from a substrate along a first direction;
a gate stack disposed on the fin and extending along a second direction substantially perpendicular to the first direction;
a gate spacer covering a sidewall of the gate stack;
a source/drain feature disposed on the fin and adjacent to the gate stack;
a contact feature disposed in an opening adjacent to the gate spacer, the opening extending along the second direction, the contact feature landing on the source/drain feature, and the contact feature including a first sidewall extending along the second direction and a second sidewall extending away from the gate spacer;
a first dielectric layer disposed in the opening and between the gate spacer and the contact feature, the first dielectric layer being in direct contact with a sidewall of the gate spacer, the first dielectric layer being in direct contact with the first sidewall of the contact feature and free from the second sidewall of the contact feature; and
a second dielectric material layer disposed in the opening and in direct contact with the first dielectric layer along a first sidewall thereof, the second dielectric material layer being in direct contact with the second sidewall of the contact feature and free from the first sidewall of the contact feature.
19 . The semiconductor structure of claim 18 further comprising a dielectric hard mask disposed on a top surface of the gate stack.
20 . The semiconductor structure of claim 18 wherein the gate spacer is composed of a first dielectric material and the first dielectric layer is composed of a second dielectric material different from the first dielectric material.