IP Library Granted Patent US 12,666,569
Granted Patent B2
US 12,666,569 · App. 18/733,623 · Granted Jun 23, 2026

Liquid immersion cooling platform and components thereof

Inventors: John David Enright (Plano, TX); Raquel Parker (Plano, TX); Darshan Patell (Plano, TX); Randall Coburn (Plano, TX); Josh Haley (Plano, TX); Ryan Graham (Plano, TX); Jason Erickson (Plano, TX); Jacob Mertel (Plano, TX); Taylor Monnig (Plano, TX); Brian Haught (Plano, TX); Ryan Myre (Plano, TX); William Bret Boren (Plano, TX); Andrew Downs (Plano, TX); Dustin Yeatman (Plano, TX); Edward King (Plano, TX); Rick Margerison (Plano, TX); Jimil M. Shah (Plano, TX); William Hadala (Plano, TX); Josh Whitaker (Plano, TX); Seamus Egan (Plano, TX); Brad Furnish (Plano, TX); Tim Tomlin (Plano, TX)
Assignee: Modine LLC
H05K7/203H05K7/20327H05K7/20381H05K7/20818H05K7/20836
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Quick Facts
Patent No.
US 12,666,569
App. No.
18/733,623
Filed
Jun 4, 2024
Granted
Jun 23, 2026
Kind
B2
Art Unit
2841
USPC
361/700
Abstract

An immersion cooling system and methods for operating the system are described. The system includes a vessel configured to hold thermally conductive, condensable dielectric fluid; a pressure controller to reduce or increase an interior pressure of the vessel; a computer component to be at least partially submerged within the dielectric fluid; and a fluid circulation system to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel.

Claims (35)

1 . A system comprising:

a vessel including a tank having a storage area; and

a plurality of chassis positioned in the storage area, each chassis of the plurality of chassis being at least partially filled with a fluid,

wherein each chassis of the plurality of chassis is configured to receive therein one of a plurality of computer components, each computer component of the plurality of computer components being at least partially submerged in the fluid within a respective chassis of the plurality of chassis,

wherein the fluid within each respective chassis of the plurality of chassis is configured to remove heat generated by each computer component of the plurality of computer components from the respective chassis of the plurality of chassis,

wherein the system further comprises a plurality of fluid connectors, wherein each fluid connector of the plurality of fluid connectors is attached to a respective chassis of the plurality of chassis, and wherein each fluid connector is configured to provide the fluid to the respective chassis of the plurality of chassis to at least partially fill the respective chassis of the plurality of chassis with the fluid, and

wherein the tank includes a sump area that stores the fluid, and wherein the system further comprises a pump that is configured to draw the fluid from the sump area and move the fluid through the respective fluid connector of each chassis of the plurality of chassis.

2 . The system of claim 1 , further comprising a filter, wherein the pump passes the fluid through the filter before passing the fluid through the plurality of fluid connectors.

3 . The system of claim 1 , wherein the plurality of fluid connectors is a plurality of first fluid connectors, wherein the system further comprises a plurality of second fluid connectors, wherein each second fluid connector of the plurality of second fluid connectors is attached to a respective chassis of the plurality of chassis and is configured to provide an outlet for the fluid in the respective chassis of the plurality of chassis.

4 . A system comprising:

a vessel including a tank having a storage area; and

a plurality of chassis positioned in the storage area, each chassis of the plurality of chassis being at least partially filled with a fluid,

wherein each chassis of the plurality of chassis is configured to receive therein one of a plurality of computer components, each computer component of the plurality of computer components being at least partially submerged in the fluid within a respective chassis of the plurality of chassis,

wherein the fluid within each respective chassis of the plurality of chassis is configured to remove heat generated by each computer component of the plurality of computer components from the respective chassis of the plurality of chassis,

wherein the system further comprises a plurality of fluid connectors, wherein each fluid connector of the plurality of fluid connectors is attached to a respective chassis of the plurality of chassis, and wherein each fluid connector is configured to provide the fluid to the respective chassis of the plurality of chassis to at least partially fill the respective chassis of the plurality of chassis with the fluid, and

wherein each fluid connector of the plurality of fluid connectors is a valve that is operable to control a level of the fluid within the respective chassis of the plurality of chassis.

5 . The system of claim 4 , further comprising a controller configured to provide instructions to each fluid connector of the plurality of fluid connectors to control the level of the fluid within the respective chassis of the plurality of chassis.

6 . The system of claim 5 , further comprising a plurality of sensors, wherein each sensor of the plurality of sensors is configured to detect the level of the fluid within a respective chassis of the plurality of chassis, and wherein the controller is configured to receive a signal from each sensor indicating the detected level of the fluid within the respective chassis of the plurality of chassis and provide instructions to the plurality of fluid connectors according to the signals received from the plurality of sensors.

7 . The system of claim 1 , wherein the fluid within each chassis of the plurality of chassis is vaporized as the fluid removes the heat from the respective chassis of the plurality of chassis, and wherein each chassis of the plurality of chassis includes a heat exchanger that removes the heat from the vaporized fluid to condense the fluid into liquid form.

8 . The system of claim 7 , wherein each chassis of the plurality of chassis includes a cooling medium connector that receives a cooling medium, and wherein each chassis of the plurality of chassis includes a cooling medium transfer pipe that extends between the respective cooling medium connector and the respective heat exchanger to absorb the heat from the vaporized fluid within each respective chassis of the plurality of chassis to condense the vaporized fluid into liquid form.

9 . The system of claim 1 , wherein the fluid within each chassis of the plurality of chassis is vaporized while the fluid removes the heat from each chassis of the plurality of chassis, wherein the system further comprises a heat exchanger within the tank at a location spaced from the plurality of chassis, and wherein the heat exchanger is configured to remove the heat from the vaporized fluid, which has escaped through an orifice in each chassis of the plurality of chassis, such that the vaporized fluid is condensed into liquid form.

10 . The system of claim 9 , wherein the sump area is configured to store the fluid and receive the fluid that has been condensed into liquid form by the heat exchanger.

11 . The system of claim 1 , wherein a first chassis of the plurality of chassis includes an orifice that allows vaporized fluid to escape from the first chassis, and wherein a second chassis of the plurality of chassis is sealed such that vaporized fluid is inhibited from escaping from the second chassis.

12 . A chassis configured to cool computer components within a storage area of a tank, the chassis comprising:

a fluid connector configured to receive a fluid in liquid form, and

a volume, a portion of the volume filled with the fluid in liquid form, the volume being configured to receive a computer component,

wherein the fluid is configured to remove heat from the computer component to cool the computer component,

wherein the fluid is configured to vaporize while the fluid removes the heat from the computer component,

wherein the vaporized fluid is configured to condense and return to the portion of the volume filled with the fluid in liquid form, and

wherein the fluid is configured to be vaporized while the fluid removes the heat from the computer component, and wherein the chassis further comprises a heat exchanger that is configured to remove the heat from the vaporized fluid to condense the fluid into liquid form.

13 . The chassis of claim 12 , further comprising a cooling medium connector that is configured to receive a cooling medium and a cooling medium transfer pipe that extends between the cooling medium connector and the heat exchanger to provide a conduit for the cooling medium to travel from the cooling medium connector to the heat exchanger, and wherein the cooling medium is configured to absorb the heat from the vaporized fluid within the chassis such that the fluid is condensed into liquid form.

14 . The chassis of claim 12 , wherein the chassis defines an orifice through which the vaporized fluid escapes from the chassis.

15 . The chassis of claim 12 , wherein the fluid connector is a first fluid connector, and wherein the chassis further comprises a second fluid connector that is configured to provide an outlet for the fluid in the chassis.

16 . The chassis of claim 15 , wherein each of the first fluid connector and the second fluid connector is a valve, wherein the chassis further comprises a controller that is configured to open and close the first fluid connector and the second fluid connector to control a level of the fluid within the volume of the chassis.

17 . The chassis of claim 16 , further comprising a sensor that is configured to detect the level of the fluid within the volume of the chassis and send a signal to the controller indicating the detected level of the fluid, and wherein the controller is configured to open and close the first fluid connector and the second fluid connector to adjust the level of the fluid based on the signal received from the sensor.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2025
From: HADALA, WILLIAM
To: TMGCORE, INC.
Reel/Frame 071128/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2025
From: TMGCORE, INC.
To: MODINE LLC
Reel/Frame 071129/0498 →
EMPLOYMENT AGREEMENT Recorded May 15, 2025
From: MYRE, RYAN
To: TMGCORE, LLC
Reel/Frame 071281/0034 →
CHANGE OF NAME Recorded May 15, 2025
From: TMGCORE, LLC
To: TMGCORE, INC.
Reel/Frame 071281/0273 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2025
From: KING, EDWARD; PATELL, DARSHAN; HALEY, JOSH; GRAHAM, RYAN; ERICKSON, JASON; MONNIG, TAYLOR; HAUGHT, BRIAN; ENRIGHT, JOHN DAVID; SHAH, JIMIL M.; MERTEL, JACOB; YEATMAN, DUSTIN; EGAN, SEAMUS; FURNISH, BRAD; TOMLIN, TIM; COBURN, RANDALL; DOWNS, ANDREW
To: TMGCORE, INC.
Reel/Frame 071290/0899 →
CONFIDENTIALITY, NON-COMPLETE, AND INTELLECTUAL PROPERTY AGREEMENT Recorded May 15, 2025
From: MARGERISON, RICHARD
To: TMGCORE, INC.
Reel/Frame 071291/0001 →
EMPLOYMENT AGREEMENT Recorded May 15, 2025
From: WHITAKER, JOSHUA
To: TMGCORE, LLC
Reel/Frame 071291/0028 →
EMPLOYMENT AGREEMENT Recorded May 15, 2025
From: PARKER, RAQUEL
To: TMGCORE, LLC
Reel/Frame 071291/0046 →
CONFIDENTIALITY, NON-COMPETE AND INTELLECTUAL PROPERTY AGREEMENT Recorded May 15, 2025
From: BOREN, WILLIAM
To: TMGCORE, LLC
Reel/Frame 071291/0084 →
Continuity (12)
Continuation 17837906 · Jun 10, 2022
Continuation In Part 17136474 · Dec 29, 2020
Provisional Application 63278330 · Nov 11, 2021
Provisional Application 63278365 · Nov 11, 2021
Provisional Application 63278358 · Nov 11, 2021
Provisional Application 63278312 · Nov 11, 2021
Provisional Application 63278167 · Nov 11, 2021
Provisional Application 63278178 · Nov 11, 2021
Provisional Application 63278175 · Nov 11, 2021
Provisional Application 63278223 · Nov 11, 2021
Provisional Application 63209258 · Jun 10, 2021
Related Publication 20240381576A1 · Nov 14, 2024
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