Plasma showerhead assembly and method of reducing defects
Plasma showerhead assemblies are disclosed comprising a conductive plate having a plurality of the conductive plate gas openings, a dielectric faceplate having a thickness and a plurality of dielectric faceplate gas openings extending through the dielectric faceplate thickness in fluid communication with the plurality of the conductive plate gas openings. A conductive insert is disposed within at least one of the dielectric faceplate gas openings or adjacent o-rings included in the plasma showerhead assemblies.
1 . A plasma showerhead assembly comprising:
a conductive plate including a plurality of gas channels and a plurality of conductive plate gas openings;
a dielectric faceplate comprising a plurality of dielectric resonators and a plurality of dielectric faceplate gas openings in fluid communication with the plurality of the conductive plate gas openings, the dielectric faceplate configured to be assembled to the conductive plate;
a plurality of o-rings surrounding the plurality of conductive plate gas openings and the plurality of dielectric faceplate gas openings and configured to seal the plurality of dielectric faceplate gas openings and the plurality of conductive plate gas openings from atmospheric pressure; and
a conductive insert disposed within at least one of the plurality of dielectric faceplate gas openings, the conductive insert having a length with an aperture extending through the length of the conductive insert, the aperture having an inner diameter.
2 . The plasma showerhead assembly of claim 1 , wherein the conductive insert comprises a conductive material.
3 . The plasma showerhead assembly of claim 2 , wherein the conductive material is selected from the group consisting of aluminum, nickel, titanium, molybdenum, doped silicon and alloys comprising a combination of one or more aluminum, nickel, titanium, molybdenum, and doped silicon.
4 . The plasma showerhead assembly of claim 2 , wherein the dielectric faceplate has a first surface and a second surface opposite to the first surface defining a dielectric faceplate thickness, and the conductive insert has extends along a portion of the thickness of the dielectric faceplate.
5 . The plasma showerhead assembly of claim 4 , wherein the conductive insert extends from the first surface of the dielectric faceplate.
6 . The plasma showerhead assembly of claim 5 , wherein the conductive insert extends along at least 25% of the thickness of the dielectric faceplate.
7 . The plasma showerhead assembly of claim 5 , wherein the conductive insert extends along 25%-50% of the thickness of the dielectric faceplate.
8 . The plasma showerhead assembly of claim 4 , wherein the conductive insert extends along greater than 50% of the thickness of the dielectric faceplate.
9 . The plasma showerhead assembly of claim 4 , wherein the conductive insert extends along 100% of the thickness of the dielectric faceplate.
10 . The plasma showerhead assembly of claim 4 , wherein the conductive insert extends from the second surface of the dielectric faceplate.
11 . The plasma showerhead assembly of claim 10 , wherein the conductive insert extends along at least 25% of the thickness of the dielectric faceplate.
12 . The plasma showerhead assembly of claim 10 , wherein the conductive insert extends along 25%-50% of the thickness of the dielectric faceplate.
13 . The plasma showerhead assembly of claim 10 , wherein the conductive insert extends along greater than 50% of the thickness of the dielectric faceplate.
14 . The plasma showerhead assembly of claim 10 , wherein the conductive insert extends along 100% of the thickness of the dielectric faceplate.
15 . The plasma showerhead assembly of claim 2 , wherein the conductive insert surrounds a portion of at least one of the plurality of o-rings.
16 . The plasma showerhead assembly of claim 15 , wherein the conductive insert provides a shield to the at least one of the plurality of o-rings and prevents microwave plasma from damaging the at least one of the plurality of o-rings.
17 . A microwave plasma processing chamber comprising:
the plasma showerhead assembly of claim 2 ;
a substrate processing region; and
a microwave plasma power supply configured to generate a microwave plasma that is delivered through the plasma showerhead assembly.
18 . A method of processing a substrate in the microwave plasma processing chamber of claim 17 , the method comprising:
generating a microwave plasma and delivering the microwave plasma through the plasma showerhead assembly; and
attenuating the microwave plasma with the conductive insert.
19 . A method of reducing defects in the microwave plasma processing chamber of claim 17 , the method comprising inserting the conductive insert within the at least one of the plurality of dielectric faceplate gas openings.