IP Library › Granted Patent US 1,126,932
Granted Patent S1
US 1,126,932 · App. 29/845,735 · Granted May 19, 2026

Upper edge ring of a process kit for semiconductor substrate processing

Inventors: Muhannad Mustafa (Santa Clara, CA); Muhammad M. Rasheed (San Jose, CA); Yu Lei (Belmont, CA); Avgerinos V. Gelatos (Redwood City, CA); Vikash Banthia (Los Altos, CA); Victor H. Calderon (Sunnyvale, CA); Shi Wei Toh (Sunnyvale, CA); Yung-Hsin Lee (San Jose, CA); Anindita Sen (San Jose, CA)
Assignee: APPLIED MATERIALS, INC.
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Quick Facts
Patent No.
US 1,126,932
App. No.
29/845,735
Granted
May 19, 2026
Kind
S1
Claims (1)

The ornamental design for an upper edge ring of a process kit for semiconductor substrate processing, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2022
From: MUSTAFA, MUHANNAD; RASHEED, MUHAMMAD M.; LEI, YU; GELATOS, AVGERINOS V.; BANTHIA, VIKASH; CALDERON, VICTOR H.; TOH, SHEI WEI; LEE, YUNG-HSIN; SEN, ANINDITA
To: APPLIED MATERIALS, INC.
Reel/Frame 060685/0507 →
Continuity (1)
Continuation 16249716 · Jan 16, 2019
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