Circuit device
Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.
1. A circuit device, comprising:
a conductive pattern;
a covering resin for covering the conductive pattern except for an opening portion; and
a semiconductor element electrically connected to the conductive pattern exposed from the opening portion through a conductive paste,
wherein the opening portion is formed to be smaller than the semiconductor element, and
the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the opening portion.
2. The circuit device according to claim 1 ,
wherein the conductive paste is a silver paste.
3. The circuit device according to claim 1 ,
wherein a plating film is formed on a surface of the conductive pattern exposed from the opening portion.
4. The circuit device according to claim 1 ,
wherein the opening portion is provided along a middle portion of each side of the semiconductor element, and
a corner portion of the semiconductor element is adhered to the covering resin with the conductive paste interposed therebetween.
5. The circuit device according to claim 1 ,
wherein a sealing resin is formed so as to seal the semiconductor element.
6. The circuit device according to claim 1 ,
wherein the conductive pattern has a multi-layered wiring structure.