Semiconductor device
A semiconductor device formed by mutually connecting a first semiconductor chip with second and third semiconductor chips arranged side by side, with the active surface of the first chip faced to those of the second and third chip. Both the second and third semiconductor chips have functional elements on their active surface. The first semiconductor chip has, in its active surface, a wiring for connecting the second semiconductor chip and the third semiconductor chip, and a terminal for external connection on its surface opposite to its active surface.
1. A semiconductor device, comprising:
a first semiconductor chip having an active first chip surface and a non-active first chip surface;
a second semiconductor chip bonded to the active first chip surface of the first semiconductor chip, the second semiconductor chip having an active second chip surface and a non-active second chip surface, the active second chip surface facing the active first chip surface of the first semiconductor chip;
a third semiconductor chip bonded to the non-active second chip surface of the second semiconductor chip, the third semiconductor chip having an active third chip surface and a non-active third chip surface, the active third chip surface facing the non-active second chip surface of the second semiconductor chip;
a wiring, provided within a through hole formed in the second semiconductor chip, for electrically connecting the second semiconductor chip and the third semiconductor chip; and
a terminal for external connection provided on the non-active first chip surface of the first semiconductor chip.
2. A semiconductor device according to claim 1 , further comprising:
a fourth semiconductor chip bonded to the non-active third chip surface of the third semiconductor chip, the fourth semiconductor chip having an active fourth chip surface and a non-active fourth chip surface, the active fourth chip surface facing the non-active third chip surface of the third semiconductor device; and
another wiring, provided within a through hole formed in the third semiconductor chip, for electrically connecting the third semiconductor chip and the fourth semiconductor chip.
3. A semiconductor device, comprising:
a first semiconductor chip having an active first chip surface and a non-active first chip surface; and
a plurality of second semiconductor chips stacked one onto another, each of the plurality of second semiconductor chips having an active second chip surface facing toward the active first chip surface of the first semiconductor chip;
the plurality of second semiconductor chips including a lowermost second semiconductor chip having the active second chip surface thereof bonded to the active first chip surface of the first semiconductor chip;
a wiring, provided within a through hole formed in the lowermost second semiconductor chip, for electrical connection between the lowermost second semiconductor chip and another one of the second semiconductor chips stacked on the lowermost second semiconductor chip.
4. A semiconductor device according to claim 3 , wherein the plurality of second semiconductor chips further includes a topmost second semiconductor chip stacked at the top of the plurality of second semiconductor chips, the topmost second semiconductor chip being free from any through hole within which a wiring member is provided.