Thermal paste containment for semiconductor modules
View Patent ↗A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.
1. A semiconductor module comprising:
a substrate;
a die, having a periphery, on said substrate;
a thermal compound covering said die;
a barrier adjacent said periphery of said die;
a planar lid on said thermal compound and extending horizontally beyond said barrier,
wherein said barrier is adapted to contain said thermal compound and to flex in response to expansion and contraction of said substrate and said lid and wherein said barrier comprises a flexible cured polymer material that adheres directly to said substrate and said lid.
2. A semiconductor module comprising:
a substrate;
a die, having a periphery, on said substrate;
a thermal compound covering said die;
a barrier adjacent said periphery of said die;
a planar lid on said thermal compound and extending horizontally beyond said barrier,
wherein said barrier is adapted to contain said thermal compound and to flex in response to expansion and contraction of said substrate and said lid,
wherein said barrier comprises a rigid material and at least one of a flexible first connection between said substrate and said barrier and a flexible second connection between said barrier and said lid,
wherein said lid comprises a bottom surface positioned adjacent said thermal compound and a groove in said bottom surface;
wherein said groove is adapted for receiving said barrier, and
wherein said second flexible connection comprises a flexible cured polymer material adhering said barrier within said groove.
3. A semiconductor module comprising:
a substrate;
a die, having a periphery, on said substrate;
a thermal compound covering said die;
a barrier adjacent said periphery of said die;
a planar lid on said thermal compound and extending horizontally beyond said barrier,
wherein said barrier is adapted to contain said thermal compound and to flex in response to expansion and contraction of said substrate and said lid,
wherein said barrier comprises a rigid material and at least one of a flexible first connection between said substrate and said barrier and a flexible second connection between said barrier and said lid,
wherein said barrier comprises a metal baffier machined into said lid, and
wherein said first flexible connection comprises a flexible cured polymer material adhering said barrier to said substrate.
4. A semiconductor module comprising:
a substrate;
a die, having a periphery, on said substrate;
a thermal compound covering said die;
a barrier adjacent said periphery of said die;
a planar lid on said thermal compound and extending horizontally beyond said barrier,
wherein said barrier is adapted to contain said thermal compound and to flex in response to expansion and contraction of said substrate and said lid,
wherein said lid comprises a plurality of extensions that project away from said lid towards said substrate and that are aligned above said barrier, and
wherein said plurality of extensions are adapted to penetrate and remain fixed to said barrier when said lid covers said die.
5. The module of claim 4 , wherein said barrier comprises a flexible cured polymer material adhered directly to said substrate.
6. The module of claim 4 , wherein said barrier comprises a rigid material, and wherein said a flexible cured polymer material adheres said barrier to said substrate.