Method and apparatus for optimizing heat transfer with electronic components
View Patent ↗A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.
1. A heat transfer method comprising: providing a heat sink assembly; providing a source of heat comprising a module substrate supporting one or more heat source elements thereupon, wherein each of the one or more heat source elements has space between it and the heat sink assembly when joined to the source of heat; and, encapsulating the one or more heat source elements in a thermally conductive medium with an encapsulating mechanism so that the thermally conductive medium remains in any space between the one or more heat source elements and the heat sink assembly, wherein the heat sink assembly has a larger outside diameter than the encapsulating mechanism, wherein a loading assembly urges the one or more heat source elements toward engagement with the heat sink assembly external to the module substrate and the encapsulating mechanism, and wherein the height of the encapsulating mechanism is adjusted to be adequately higher than the tallest of the one or more heat source elements when the encapsulating mechanism is compressed.
2. The heat transfer method of claim 1 wherein the encapsulating is provided by the encapsulating mechanism that includes a sealing element that encompasses the one or more heat source elements and the thermally conductive medium, wherein the sealing element is compressible to provide a fluid-tight seal at junctions between the source of heat and the sealing element, and at junctions between the heat sink assembly and the sealing element.
3. The heat transfer method of claim 2 wherein the sealing element is provided with a coefficient of thermal expansion (CTE) value between a coefficient of thermal expansion (CTE) value of the heat sink assembly and a coefficient of thermal expansion (CTE) value of the source of heat.
4. The heat transfer method of claim 2 wherein the sealing element is a gasket member that has been applied to a predetermined height that is sufficient to enclose the one or more heat source elements and the thermally conductive medium.
5. The assembly of claim 1 wherein the thermally conductive medium is a thermal grease.
6. A heat transfer assembly comprising: a source of heat comprising a module substrate supporting one or more heat source elements thereupon, a heat sink assembly adapted to be placed in juxtaposition with the one or more heat source elements; a loading assembly for urging under loading the one or more heat source elements toward engagement with the heat sink assembly; and, an encapsulating mechanism that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the one or more heat source elements and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more heat source elements and the heat sink assembly, wherein the heat sink assembly has a larger outside diameter than the encapsulating mechanism, wherein the loading assembly urges the one or more heat source elements toward engagement with the heat sink assembly external to the module substrate and the encapsulating mechanism, and wherein the height of the encapsulating mechanism is adjusted to be adequately higher than the tallest of the one or more heat source elements when the encapsulating mechanism is compressed.
7. The assembly of claim 6 wherein the encapsulating mechanism includes a sealing element that encompasses the one or more heat source elements and the thermally conductive medium, wherein the sealing element is compressible to provide a fluid-tight seal at junctions between the source of heat and the sealing element, and at junctions between the heat sink assembly and the sealing element.
8. The assembly of claim 7 wherein the sealing element has a coefficient of thermal expansion (CTE) value between a coefficient of thermal expansion (CTE) value of the heat sink assembly and a coefficient of thermal expansion (CTE) value of the source of heat.
9. The assembly of claim 7 wherein the sealing element has been applied to a predetermined height higher than is sufficient to encompass the one or more heat source elements and the thermally conductive medium.
10. The assembly of claim 7 wherein the thermally conductive medium is a thermal grease.
11. A heat transfer assembly comprising: a printed circuit board assembly; an electronic component assembly comprising a module substrate supporting one or more semiconductor chips, the module substrate supported by the printed circuit board assembly; a heat sink assembly adapted to be placed in thermal juxtaposition with the one or more semiconductor chips; a loading assembly for urging, under loading, the one or more semiconductor chips toward engagement with the heat sink assembly; and, an encapsulating mechanism that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly, wherein the heat sink assembly has a larger outside diameter than the encapsulating mechanism, wherein the loading assembly urges the one or more heat source elements toward engagement with the heat sink assembly external to the module substrate and the encapsulating mechanism, and wherein the height of the encapsulating mechanism is adjusted to be adequately higher than the tallest of the one or more heat source elements when the encapsulating mechanism is compressed.
12. The assembly of claim 11 wherein the encapsulating mechanism includes a sealing element that encompasses the one or more semiconductor chips, wherein the sealing element is compressible to provide a fluid-tight seal between the electronic component and the sealing element, and the heat sink assembly and the sealing element.
13. The assembly of claim 12 wherein the sealing element is a gasket made of a resinous material.
14. The assembly of claim 12 where the sealing element has a coefficient of thermal expansion (CTE) value between a coefficient of thermal expansion (CTE) value of the heat sink assembly and a coefficient of thermal expansion (CTE) value of the an electronic component assembly.
15. The assembly of claim 12 wherein the sealing element has been applied as a strip to a predetermined height sufficient to encompass the one or more semiconductor chips and the thermally conductive medium.
16. The assembly of claim 12 wherein the thermally conductive medium is a thermal grease.