Interconnect assembly for testing integrated circuit packages
An interconnect assembly is provided for electrically connecting first and second circuit members. Each of the circuit members comprises an array of electrical contacts. The interconnect assembly includes a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members. The interconnect assembly also includes a carrier defining a plurality of apertures for receiving the conductors and at least one retainer contacting each conductor. Each of the retainers has a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.
1. An interconnect assembly for electrically connecting first and second circuit members, each of the first and second circuit members including an array of electrical contacts, the interconnect assembly comprising:
a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members;
a conductor carrier defining a plurality of apertures for receiving the conductors; and
at least one conductor retainer contacting each conductor at a preselected location on the conductor, each conductor retainer having a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.
2. The interconnect assembly according to claim 1 , wherein each of the conductor retainers comprises an annular member grippingly received by one of the conductors.
3. The interconnect assembly according to claim 2 , wherein each of the conductor retainers comprises at least one of a resilient o-ring, a split ring, a crimp ring, and a shrink tube.
4. The interconnect assembly according to claim 1 , wherein the conductor carrier comprises upper and lower members each defining a portion of each of the apertures, and wherein each of the conductor retainers is located within one of the apertures of the conductor carrier.
5. The interconnect assembly according to claim 4 , wherein at least one of the upper and lower members of the conductor carrier defines a recess at each of the apertures, the recess comprising at least one of beveled surface, a radiused surface, and a tiered surface.
6. The interconnect assembly according to claim 1 , wherein the conductor retainers comprise an upper conductor retainer and a lower conductor for each of the conductors, the upper and lower conductor retainers located on opposite sides of the conductor carrier.
7. The interconnect assembly according to claim 1 , wherein each of the conductor retainers comprises an insert member received within an interior defined by one of the conductors, the insert member configured to contact and enlarge a portion of the conductor to a diameter that is greater than a nominal diameter of the conductor.
8. The interconnect assembly according to claim 1 , wherein each of the conductors comprises an elongated body portion defining a plurality of openings.
9. The interconnect assembly according to claim 1 , wherein each of the conductors comprises an elongated body portion comprising a plurality of interlaced wires.
10. The interconnect assembly according to claim 9 , wherein each of the wires extends along a substantially helical path.
11. The interconnect assembly according to claim 8 , wherein the elongated body portion of each conductor defines at least one of the opposite ends of the conductor.
12. An interconnect assembly for electrically connecting a semiconductor package to a load board configured for use with a package testing system, each of the package and the load board including an array of electrical contacts, the interconnect assembly comprising:
a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the package and the load board;
a carrier defining a plurality of apertures each configured for receiving one of the conductors; and
a plurality of retainers each contacting one of the conductors and located within one of the apertures of the carrier, each of the retainers having a maximum diameter that is greater than a minimum diameter of the carrier apertures such that each of the conductors is retained by the carrier.
13. The interconnect assembly according to claim 12 , wherein each of the retainers comprises an annular member.
14. The interconnect assembly according to claim 13 , wherein each of the retainers comprises at least one of a resilient o-ring, a split ring, a crimp ring, and a shrink tube grippingly received by one of the conductors.
15. The interconnect assembly according to claim 12 , wherein each of the retainers comprises an insert member received within an interior of one of the conductors, and wherein the insert member is configured to contact the conductor and outwardly expand a portion of the conductor.
16. The interconnect assembly according to claim 13 , wherein each of the conductors comprises an elongated body portion comprising a plurality of interlaced wires.
17. An interconnect assembly for electrically connecting first and second circuit members, each of the first and second circuit members including an array of electrical contacts, the interconnect assembly comprising:
a plurality of electrical conductors having opposite ends configured for contacting the electrical contacts of the first and second circuit members, each of the conductors including a compressible body defining a plurality of openings and an interior;
a carrier defining a plurality of apertures configured for receipt of the conductors; and
a plurality of insert members each received within the interior of the body of one of the conductors and configured such that an adjacent portion of the conductor body is outwardly expanded to a maximum diameter that is greater than a minimum diameter of the carrier apertures.
18. The interconnect assembly according to claim 17 , wherein the carrier comprises upper and lower plates each defining a portion of the aperture.
19. The interconnect assembly according to claim 18 , wherein at least one of the upper and lower plates of the carrier defines a recess at each of the apertures, the recess comprising at least one of beveled surface, a radiused surface, and a tiered surface.
20. The interconnect assembly according to claim 17 , wherein the compressible body of each of the conductors comprises a plurality of interlaced wires.