Circuit device
The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.
1. A circuit device comprising:
a substrate provided with ground wiring
a plurality of circuit elements laminated on said substrate;
a pair of insulation layers provided between at least one set of an upper-layer circuit element and a lower-layer circuit element disposed adjacent to each other, among said plurality of circuit elements; and
a conductive layer interposed between said pair of insulation layers,
wherein the upper-layer circuit element connects to the ground wiring by way of said conductive layer;
the upper-layer circuit element, and a first wire connecting the upper-layer circuit element and the conductive layer are sealed by a first encapsulating resin; and
the upper-layer circuit element sealed by the first encapsulating resin and a second wire connecting the conductive layer and the ground wiring are sealed by a second encapsulating resin.
2. A circuit device according to claim 1 , wherein among the plurality of circuit elements a lowest-layer circuit element is flip-chip bonded to said substrate.
3. A circuit device according to claim 1 with two circuit elements laminated therein, wherein the top circuit element connects to the ground wiring by way of said conductive layer provided between the top circuit element and the bottom circuit element.
4. A circuit device according to claim 1 with three or more circuit elements laminated therein, wherein each circuit element disposed second from the bottom and upper than second therefrom connects to the ground wiring by way of a conductive layer provided between the each circuit element and each circuit element disposed therebelow.
5. A circuit device according to claim 1 , wherein a portion of said conductive layer overlapped with said insulation layer placed above said conductive layer, which is used for grounding of a circuit element, is equal to a projected portion of the circuit element facing said insulation layer placed above said conductive layer.
6. A circuit device according to claim 1 , wherein an area of said conductive layer used for grounding of a circuit element is larger than that of an insulation layer above said conductive layer.
7. A circuit device comprising:
a ground wiring;
a plurality of circuit elements laminated on said ground wiring;
a pair of insulation layers provided between at least one set of an upper-layer circuit element and a lower-layer circuit element disposed adjacent to each other, among said plurality of laminated circuit elements; and
a conductive layer interposed between said pair of insulation layers,
wherein the upper-layer circuit element connects to said ground wiring by way of said conductive layer;
the upper-layer circuit element, and a first wire connecting the upper-layer circuit element and the conductive layer are sealed by a first encapsulating resin; and
the upper-layer circuit element sealed by the first encapsulating resin and a second wire connecting the conductive layer and the ground wiring are sealed by a second encapsulating resin.
8. A circuit device according to claim 7 with two circuit elements laminated therein, wherein the top circuit element connects to said ground wiring by way of said conductive layer provided between the top circuit element and the bottom circuit element.
9. A circuit device according to claim 7 with three or more circuit elements laminated therein, wherein each circuit element disposed second from the bottom and upper than second therefrom connects to said ground wiring by way of said conductive layer provided between the each circuit element and each circuit element disposed therebelow.
10. A circuit device according to claim 7 , wherein a portion of said conductive layer overlapped with said insulation layer placed above said conductive layer, which is used for grounding of a circuit element, is equal to a projected portion of the circuit element facing said insulation layer placed above said conductive layer.
11. A circuit device according to claim 7 , wherein an area of said conductive layer used for grounding of a circuit element is larger than that of an insulation layer above said conductive layer.