Method of manufacturing hybrid structure of multi-layer substrates
Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.
1. A method of manufacturing a hybrid structure of a plurality of multi-layer substrates, the method comprising steps of:
(a) providing a carrier to form one of the multi-layer substrates thereon;
(b) coating a dielectric layer on a surface of the carrier;
(c) forming at least one VIA at the dielectric layer and a metal layer on the dielectric layer and then coating another dielectric layer;
(d) repeating step (c) to form the multi-layer substrate;
(e) dividing a border district of the carrier and the multi-layer substrate to separate the multi-layer substrate from the carrier;
(f) separating the border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate; and
(g) connecting a separated border district of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section.
2. The method of claim 1 , further comprising a step of implementing an interface adhesion enhancing process on the border districts of the surface of the carrier to increase adhesion intensity thereon before coating the another dielectric layer during the step (b).
3. The method of claim 1 , further comprising a step of implementing an interface adhesion enhancing process on the surface of the carrier to increase adhesion intensity between the dielectric layer and the carrier and then coating one more dielectric layer on the surface of the dielectric layer during the step (b).
4. The method of claim 3 , wherein the multi-layer substrate is separated from the carrier by dividing the dielectric layer and the one more dielectric layer.
5. The method of claim 3 , further comprising a step (e′) of removing the dielectric layer adjacent to the carrier to reveal the corresponding metal layer of the dielectric layer.
6. The method of claim 1 , further comprising a step of implementing an interface adhesion enhancing process on the border district of the dielectric layer coated in step (b) to increase adhesion intensity thereon before coating the another dielectric layer during the step (c).
7. The method of claim 6 , further comprising a step (e′) of removing the dielectric layer adjacent to the carrier to reveal the corresponding metal layer.
8. The method of claim 1 , further comprising a step of implementing an interface adhesion enhancing process on rest district of the metal layer and the corresponding dielectric layer except the border district to increase adhesion intensity on the rest district before coating the another dielectric layer during the step (c).
9. The method of claim 8 , further comprising a step of removing the separated border district of the dielectric layer adjacent to the carrier to reveal the border district of the corresponding metal layer after the step (e).
10. The method of claim 1 , further comprising a step of implementing an interface adhesion weakening process on the border district to decrease adhesion intensity thereon before coating the another dielectric layer during the step (c).
11. The method of claim 10 , further comprising a step of removing the separated border district of the dielectric layer adjacent to the carrier to reveal the border district of the corresponding metal layer after the step (e).
12. The method of claim 1 , further comprising a step of connecting a first outer surface and a second outer surface of the multi-layer substrates after the connecting step.
13. The method of claim 12 , wherein the step of connecting the first outer surface and the second outer surface of the multi-layer substrates is to packaging a plurality of chip devices, a package substrate with the first outer surface and the second outer surface of the multi-layer substrates respectively.
14. The method of claim 1 , further comprising a step of connecting a first outer surface and a second outer surface of the multi-layer substrates before the connecting step.
15. The method of claim 14 , wherein the step of connecting the first outer surface and the second outer surface of the multi-layer substrates is to packaging a plurality of chip devices, a package substrate with the first outer surface and the second outer surface of the multi-layer substrates respectively.
16. A method of manufacturing a hybrid structure of a plurality of multi-layer substrates, the method comprising steps of:
(a) providing a device wafer to form one of the multi-layer substrates thereon;
(b) coating a dielectric layer on a surface of the carrier;
(c) forming at least one VIA at the dielectric layer and a metal layer on the dielectric layer and then coating another dielectric layer;
(d) repeating step (c) to form the multi-layer substrate;
(e) dividing a border district of the carrier and the multi-layer substrate to separate the multi-layer substrate from the carrier;
(f) separating the border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate; and
(g) connecting a separated border district of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section.