Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a planar surface and a cavity therein, a first barrier between the planar surface and a first interconnect, and a second barrier between the cavity and a second interconnect; providing a substrate; mounting an integrated circuit over the substrate; mounting the carrier to the substrate with the first interconnect and the second interconnect attached to the substrate and with the planar surface over the integrated circuit; forming an encapsulation between the substrate and the carrier covering the integrated circuit, the encapsulation having an encapsulation recess under the planar surface and over the integrated circuit; and removing a portion of the carrier to expose the encapsulation, a portion of the first barrier to form a first contact pad, and a portion of the second barrier to form a second contact pad.
1. An integrated circuit packaging system comprising:
a substrate;
an integrated circuit over the substrate;
a first interconnect attached to the substrate;
a second interconnect attached to the substrate;
an encapsulation having an encapsulation recess and an encapsulation plateau covering the first interconnect, the second interconnect, and the integrated circuit with the encapsulation recess over the integrated circuit, the first interconnect under the encapsulation recess, and the second interconnect under the encapsulation plateau;
a first contact pad exposed along the encapsulation recess and attached to the first interconnect; and
a second contact pad exposed along the encapsulation plateau and attached to the second interconnect.
2. The system as claimed in claim 1 further comprising a mounting pad exposed from an inner portion of the encapsulation recess.
3. The system as claimed in claim 1 further comprising:
a ground interconnect attached to the substrate and adjacent to the integrated circuit; and
a conductive shield exposed from the encapsulation with the conductive shield over the integrated circuit and connected to the ground interconnect and the ground interconnect grounded.
4. The system as claimed in claim 1 further comprising a device connected to the first contact pad with the device in the encapsulation recess.
5. The system as claimed in claim 1 further comprising a mountable structure connected to the second contact pad with mountable structure over the encapsulation plateau.
6. The system as claimed in claim 1 wherein:
the substrate includes a substrate first side and a substrate second side;
the integrated circuit is mounted over the substrate first side; and
the first interconnect is adjacent to the integrated circuit.
7. The system as claimed in claim 6 further comprising:
a device connected to the first contact pad with the device in the encapsulation recess; and
a mountable structure connected to the second contact pad with the device between the mountable structure and the encapsulation.
8. The system as claimed in claim 6 further comprising an interface interconnect between the first interconnect and the substrate, and between the second interconnect and the substrate.
9. The system as claimed in claim 6 wherein the first contact pad and the second contact pad have the characteristics of a carrier removed by etching.
10. The system as claimed in claim 6 wherein the integrated circuit includes a flip-chip.