Optoelectronic device with germanium photodetector
View Patent ↗An optoelectronic device comprises a photodetector feature, an interfacial layer disposed above at least a portion of the photodetector feature, and a vertical contact disposed on at least a portion of the interfacial layer. The photodetector feature comprises germanium and is operative to convert a light signal into an electrical signal. The interfacial layer comprises nickel. Finally, the vertical contact is operative to transmit the electrical signal from the photodetector feature.
1. An optoelectronic device comprising:
a photodetector feature, the photodetector feature comprising germanium and operative to convert a light signal into an electrical signal;
an interfacial layer disposed above at least a portion of the photodetector feature, the interfacial layer being formed of an alloy material comprising nickel; and
a buried vertical contact via disposed on at least a portion of the interfacial layer, the buried vertical contact via operative to transmit the electrical signal from the photodetector feature, wherein the interfacial layer is formed of the alloy material comprising nickel to provide an ohmic contact between the photodetector feature and material forming the buried vertical contact via, wherein the interfacial layer comprises an alloy of nickel and silicon.
2. The optoelectronic device of claim 1 , further comprising a waveguide feature disposed adjacent to the photodetector feature, the waveguide feature operative to guide the light signal in the optoelectronic device.
3. The optoelectronic device of claim 2 , wherein the waveguide feature comprises silicon.
4. The optoelectronic device of claim 1 , wherein the photodetector feature comprises one or more p-i-n junctions or p-n junctions.
5. An optoelectronic device comprising:
a photodetector feature, the photodetector feature comprising germanium and operative to convert a light signal into an electrical signal;
an interfacial layer disposed above at least a portion of the photodetector feature, the interfacial layer comprising nickel;
a vertical contact disposed on at least a portion of the interfacial layer, the vertical contact operative to transmit the electrical signal from the photodetector feature; and
a capping layer formed at least partially between the photodetector feature and the interfacial layer.
6. The optoelectronic device of claim 5 , wherein the capping layer comprises silicon.
7. An integrated circuit including an optoelectronic device, the optoelectronic device comprising:
a photodetector, the photodetector feature comprising germanium and operative to convert a light signal into an electrical signal;
an interfacial layer disposed above at least a portion of the photodetector feature, the interfacial layer comprising nickel;
a vertical contact disposed on at least a portion of the interfacial layer, the vertical contact operative to transmit the electrical signal from the photodetector feature; and
a capping layer formed at least partially between the photodetector feature and the interfacial layer.
8. The integrated circuit of claim 7 , wherein the optoelectronic device further comprises a waveguide feature disposed adjacent to the photodetector feature, the waveguide feature operative to guide the light signal in the optoelectronic device.
9. The integrated circuit of claim 8 , wherein the waveguide feature comprises silicon.
10. The integrated circuit of claim 7 , wherein the capping layer comprises silicon.
11. The integrated circuit of claim 7 , wherein the interfacial layer comprises an alloy of nickel and silicon.
12. The integrated circuit of claim 7 , wherein the interfacial layer comprises an alloy of nickel and germanium.
13. The integrated circuit of claim 7 , wherein the photodetector feature comprises one or more p-i-n junctions or p-n junctions.
14. An integrated circuit including an optoelectronic device, the optoelectronic device comprising:
a photodetector feature, the photodetector feature comprising germanium and operative to convert a light signal into an electrical signal;
an interfacial layer disposed above at least a portion of the photodetector feature, the interfacial layer being formed of an alloy material comprising nickel; and
a buried vertical contact via disposed on at least a portion of the interfacial layer, the buried vertical contact via operative to transmit the electrical signal from the photodetector feature, wherein the interfacial layer is formed of the alloy material comprising nickel to provide an ohmic contact between the photodetector feature and material forming the buried vertical contact via, wherein the interfacial layer comprises an alloy of nickel and germanium.