Bridges for interconnecting interposers in multi-chip integrated circuits
View Patent ↗A structure and a method for forming the same. The structure includes a substrate, a first interposer on the substrate, a second interposer on the substrate, and a first bridge. The first and second interposers are electrically connected to the substrate. The first bridge is electrically connected to the first and second interposers.
1. A structure, comprising:
a substrate;
a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate; and
a first bridge electrically connected to the first and second interposers, wherein the first interposer comprises at least a first transistor, and wherein the second interposer comprises at least a second transistor.
2. The structure of claim 1 ,
wherein the substrate comprises substrate connectors,
wherein the first interposer comprises first interposer connectors,
wherein the second interposer comprises second interposer connectors,
wherein the first and second interposer connectors are electrically connected to the substrate connectors, and
wherein each connector of the substrate connectors, the first interposer connectors, and the second interposer connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.
3. The structure of claim 2 ,
wherein the first interposer further comprises first bonding connectors,
wherein the second interposer further comprises second bonding connectors,
wherein the first bridge comprises bridge connectors,
wherein the first and second bonding connectors are in direct physical contact one-to-one with the bridge connectors, and
wherein each connector of the first bonding connectors, the second bonding connectors, and the bridge connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.
4. The structure of claim 3 , further comprising a third interposer on the first interposer,
wherein the third interposer is electrically connected to the first interposer, wherein the third interposer comprises at least a third transistor.
5. The structure of claim 4 , further comprising a fourth interposer on the first interposer,
wherein the fourth interposer is electrically connected to the first interposer, and
wherein the fourth interposer comprises at least a fourth transistor.
6. The structure of claim 1 ,
wherein the first bridge comprises bridge connectors,
wherein the first interposer comprises first interposer connectors,
wherein the second interposer comprises second interposer connectors,
wherein the bridge connectors are in direct physical contact one-to-one with the first and second interposer connectors, and
wherein each connector of the first interposer connectors, the second interposer connectors, and the bridge connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.
7. The structure of claim 6 , wherein the first bridge comprises an integrated circuit.
8. The structure of claim 1 , wherein a top surface of the first bridge is external to the substrate and above a top surface of the substrate.
9. A structure, comprising:
a substrate;
a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate; and
a first bridge electrically connected to the first and second interposers, wherein the first bridge is in direct physical contact with the substrate.
10. The structure of claim 9 , wherein a first top surface of the substrate and a second top surface of the first bridge are coplanar.
11. The structure of claim 9 ,
wherein the substrate comprises substrate connectors,
wherein the first interposer comprises first interposer connectors,
wherein the second interposer comprises second interposer connectors,
wherein the first and second interposer connectors are electrically connected to the substrate connectors, and
wherein each connector of the first interposer connectors, the second interposer connectors, and the bridge connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.
12. The structure of claim 11 , further comprising a third interposer on the first interposer,
wherein the third interposer is electrically connected to the first interposer.
13. The structure of claim 12 , further comprising a fourth interposer on the first interposer,
wherein the fourth interposer is electrically connected to the first interposer.
14. The structure of claim 9 , wherein a top surface of the first bridge is external to the substrate and above a top surface of the substrate.
15. The structure of claim 9 , wherein a bottom surface of the first bridge is within the substrate and below a top surface of the substrate.
16. A structure, comprising:
a substrate;
a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate; and
a first bridge electrically connected to the first and second interposers, wherein the first bridge is in direct physical contact with the substrate,
wherein a top surface of the first bridge is external to the substrate and above a top surface of the substrate,
wherein a bottom surface of the first bridge is within the substrate and below the top surface of the substrate.
17. The structure of claim 16 , wherein the top surface of the first bridge and the bottom surface of the first bridge are parallel to each other.
18. A structure, comprising:
a substrate;
a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;
a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate; and
a first bridge electrically connected to the first and second interposers, wherein a bottom surface of the first bridge is within the substrate and below a top surface of the substrate.