Integrated circuit package system with delamination prevention structure

1. A method of manufacturing an integrated circuit package system comprising:

mounting an integrated circuit die to a carrier by an adhesive;

attaching a delamination prevention structure having an uniform thickness, directly on a center of the integrated circuit die including positioning the delamination prevention structure within the boundary of the integrated circuit die; and

encapsulating the delamination prevention structure and the integrated circuit die, with only an encapsulation between a top side of the encapsulation and the delamination prevention structure.

2. The method as claimed in claim 1 further comprising:

connecting an internal interconnect between the integrated circuit die and the carrier; and

wherein attaching the delamination prevention structure directly on the integrated circuit die includes:

attaching the delamination prevention structure adjacent to the internal interconnect.

3. The method as claimed in claim 1 further comprising:

connecting an internal interconnect between the integrated circuit die and the carrier; and

wherein attaching the delamination prevention structure over the integrated circuit die includes:

attaching the delamination prevention structure directly on the internal interconnect.

4. The method as claimed in claim 1 wherein encapsulating the delamination prevention structure and the integrated circuit die over the carrier includes forming the encapsulation having a recess over the integrated circuit die with the recess over the delamination prevention structure.

5. The method as claimed in claim 1 wherein attaching the delamination prevention structure over the integrated circuit die includes attaching a film adhesive over the integrated circuit die.

6. A method of manufacturing an integrated circuit package system comprising:

mounting an integrated circuit die to a carrier by an adhesive;

connecting an internal interconnect between the integrated circuit die and the carrier;

attaching a delamination prevention structure having an uniform thickness, directly on a center of the integrated circuit die including positioning the delamination prevention structure within the boundary of the integrated circuit die; and

forming an encapsulation having a recess over directly on the delamination prevention structure, the integrated circuit die, and the internal interconnect with the recess over the delamination prevention structure, with only the encapsulation between a top side of the encapsulation and the delamination prevention structure.

7. The method as claimed in claim 6 wherein forming the encapsulation having the recess over the delamination prevention structure and the integrated circuit die includes exposing a contact pad of the carrier by the encapsulation.

8. The method as claimed in claim 6 wherein attaching the delamination prevention structure directly on the integrated circuit die includes attaching the delamination prevention structure over the internal interconnect.

9. The method as claimed in claim 6 further comprising attaching an external interconnect under the carrier.

10. An integrated circuit package system comprising:

a carrier;

an integrated circuit die mounted to the carrier by an adhesive;

a delamination prevention structure having an uniform thickness, directly on a center of the integrated circuit die includes the delamination prevention structure is within the boundary of the integrated circuit die; and

an encapsulation directly on the delamination prevention structure and the integrated circuit die, with only the encapsulation between a top side of the encapsulation and the delamination prevention structure.

11. The system as claimed in claim 10 further comprising:

an internal interconnect between the integrated circuit die and the carrier; and

wherein the delamination prevention structure is adjacent to the internal interconnect.

12. The system as claimed in claim 10 further comprising:

an internal interconnect between the integrated circuit die and the carrier; and

wherein the delamination prevention structure is over the internal interconnect.

13. The system as claimed in of claim 10 wherein the encapsulation includes a recess over the delamination prevention structure.

14. The system as claimed in claim 10 wherein the delamination prevention structure includes a film adhesive.

15. The system as claimed in claim 10 further comprising:

an internal interconnect between the integrated circuit die and the carrier; and wherein the encapsulation includes a recess over the delamination prevention structure.

16. The system as claimed in claim 15 wherein the carrier includes a contact pad exposed by the encapsulation.

17. The system as claimed in of claim 15 wherein the delamination prevention structure is over the internal interconnect.

18. The system as claimed in claim 15 further comprising an external interconnect under the carrier.