Package module for a memory IC chip
The present invention relates to a package module for a memory IC chip, in which first solder pads provided on an upper surface of the memory IC chip is electrically connected to lower contact pads provided on the periphery of the ground pad, lower contact pads is soldered upward with lead frames and upper contact pads, and lastly a molding layer is used for packaging and enclosing the above elements, while only exposing the lower contact pads and the upper contact pads. Therefore, it will facilitate that each of upper contact pads of a lower layer is correspondingly soldered to one of lower contact pads of an upper layer as the upper layer and the lower layer are stacked together. Thus, it is capable of obtain high acceptable production yield, while accomplishing the object of expanding the memory capacity in total when stacking the layers of the package structure.
1. A package module for a memory IC chip, comprising:
a ground pad;
a plurality of lower contact pads, distributively provided on the periphery of the ground pad without electrically contacting one another;
at least a first memory IC chip, stacked on an upper side of the ground pad, an upper surface of the at least a first memory IC chip being provided with a plurality of first solder pads, each of the plurality of first solder pads being electrically connected to one of the plurality of lower contact pads via one of a plurality of golden lines;
a plurality of lead frames, each being correspondingly soldered to one of the plurality of lower contact pads;
a plurality of upper contact pads, each being correspondingly soldered to one of the plurality of lead frames; and
a molding layer, for packaging and enclosing the ground pad, the plurality of lower contact pads, the at least a first memory IC chip, the plurality of lead frames and the plurality of upper contact pads, and curing the same, wherein a lower surface of the molding layer further exposes the plurality of lower contact pads and an upper surface of the molding layer further exposes the plurality of upper contact pads.
2. A package module for a memory IC chip as claimed in claim 1 , further comprising a covered package IC for covering an upper side of the molding layer, wherein a lower surface of the covered package IC is provided with a plurality of second solder pads, each being correspondingly soldered to one of the plurality of upper contact pads.
3. A package module for a memory IC chip as claimed in claim 2 , wherein the covered package IC comprises inside at least a package memory IC chip.
4. A package module for a memory IC chip as claimed in claim 2 , wherein the covered package IC is selected from a no-lead package IC set constituted by a dual flat no-lead package IC and a quad flat no-lead package IC.
5. A package module for a memory IC chip as claimed in claim 1 , wherein the package module for a memory IC chip is configured and installed on a circuit board, an upper surface of the circuit board is provided with a plurality of metal contacts, and each of the plurality of lower contact pads exposed on the lower surface of the molding layer is correspondingly soldered to one of the plurality of metal contacts.
6. A package module for a memory IC chip, comprising a package structure having at least two layers that are stacked together, wherein the package structure of each layer includes:
a ground pad;
a plurality of lower contact pads, distributively provided on the periphery of the ground pad without electrically contacting one another;
at least a first memory IC chip, stacked on an upper side of the ground pad, an upper surface of the at least a first memory IC chip being provided with a plurality of first solder pads, each of the plurality of first solder pads being electrically connected to one of the plurality of lower contact pads via one of a plurality of golden lines;
a plurality of lead frames, each being correspondingly soldered to one of the plurality of lower contact pads;
a plurality of upper contact pads, each being correspondingly soldered to one of the plurality of lead frames; and
a molding layer, for packaging and enclosing the ground pad, the plurality of lower contact pads, the at least a first memory IC chip, the plurality of lead frames and the plurality of upper contact pads, and curing the same, in which a lower surface of the molding layer further exposes the plurality of lower contact pads and an upper surface of the molding layer further exposes the plurality of upper contact pads,
wherein each of the plurality of upper contact pads of a lower layer of a package structure is correspondingly soldered to one of the plurality of lower contact pads of an upper layer of a package structure.
7. A package module for a memory IC chip as claimed in claim 6 , further comprising a covered package IC for covering an upper side of the molding layer located on the upper most layer of the package structure, wherein a lower surface of the covered package IC is provided with a plurality of second solder pads, each being correspondingly soldered to one of the plurality of upper contact pads located on the upper most layer of the package structure.
8. A package module for a memory IC chip as claimed in claim 7 , wherein the covered package IC comprises inside at least a package memory IC chip.
9. A package module for a memory IC chip as claimed in claim 7 , wherein the covered package IC is a no-lead package IC set constituted by a dual flat no-lead package IC and a quad flat no-lead package IC.
10. A package module for a memory IC chip as claimed in claim 6 , wherein the package module for a memory IC chip is configured and installed on a circuit board, an upper surface of the circuit board is provided with a plurality of metal contacts, and each of the plurality of lower contact pads exposed on the lower surface of the molding layer located on the lowermost layer of the package structure is correspondingly soldered to one of the plurality of metal contacts on the circuit board.