Integrated circuit package system with insulator over circuitry

1. A method for manufacturing an integrated circuit package system comprising:

providing a connection array;

attaching a base integrated circuit adjacent the connection array;

attaching a package integrated circuit over the base integrated circuit;

attaching a package die connector to the package integrated circuit and the connection array;

applying a wire-in-film insulator over the package integrated circuit, the package die connector, the base integrated circuit, and the connection array, wherein the connection array and a base die connector of the base integrated circuit are partially exposed from the wire-in-film insulator; and

mounting a stiffener over the wire-in-film insulator opposite the connection array.

2. The method as claimed in claim 1 wherein providing the connection array includes providing array connectors and a connection array pad.

3. The method as claimed in claim 1 wherein providing the connection array includes providing a substrate.

4. The method as claimed in claim 1 further comprising:

providing a second connection array;

attaching the base integrated circuit adjacent the second connection array; and

attaching a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit.

5. The method as claimed in claim 1 further comprising:

providing a substrate;

attaching the base integrated circuit over the substrate; and

attaching a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit.

6. A method for manufacturing an integrated circuit package system comprising:

forming a connection array having array connectors;

mounting a base integrated circuit having base die connectors adjacent the array connectors of the connection array;

attaching a package integrated circuit over the base integrated circuit on a side opposite the base die connectors;

connecting a package die connector to the package integrated circuit and the connection array with the array connector;

forming a wire-in-film insulator over the package integrated circuit, the package die connector, the base integrated circuit, the base die connectors, and the connection array, wherein the array connectors and the base die connectors are partially exposed from the wire-in-film insulator; and

mounting a stiffener over the wire-in-film insulator opposite the connection array.

7. The method as claimed in claim 6 wherein providing the connection array includes providing the array connectors and a punched-up die pad having characteristics of a leadframe.

8. The method as claimed in claim 6 wherein providing the connection array includes providing a substrate having a substrate cavity for the base integrated circuit.

9. The method as claimed in claim 6 further comprising:

providing a second connection array;

attaching the base integrated circuit adjacent the second connection array;

attaching a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit; and

forming a second insulator over the stack module and the base integrated circuit.

10. The method as claimed in claim 6 further comprising:

providing a substrate;

attaching the base integrated circuit over the substrate;

attaching a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit; and

forming a second insulator over the stack module and the base integrated circuit.

11. An integrated circuit package system comprising:

a connection array;

a base integrated circuit adjacent the connection array;

a package integrated circuit over the base integrated circuit;

a package die connector attached to the package integrated circuit and the connection array;

a wire-in-film insulator over the package integrated circuit, the package die connector, the base integrated circuit, and the connection array, wherein the connection array and a base die connector of the base integrated circuit is partially exposed from the wire-in-film insulator; and

a stiffener over the wire-in-film insulator opposite the connection array.

12. The system as claimed in claim 11 wherein the connection array includes array connectors and a connection array pad.

13. The system as claimed in claim 11 wherein the connection array is a substrate.

14. The system as claimed in claim 11 further comprising:

a second connection array with the base integrated circuit attached adjacent the second connection array; and

a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit.

15. The system as claimed in claim 11 further comprising:

a substrate with the base integrated circuit over the substrate; and

a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit.

16. The system as claimed in claim 11 wherein:

the connection array has array connectors;

the base integrated circuit is adjacent the array connectors of the connection array;

the package integrated circuit is over the base integrated circuit on a side opposite the base die connectors;

the package die connector is connected to the package integrated circuit and the connection array with the array connectors; and

the wire-in-film insulator is over the package integrated circuit, the package die connector, the base integrated circuit, the base die connectors, and the connection array, wherein the array connectors are partially exposed.

17. The system as claimed in claim 16 wherein the connection array includes the array connectors and a punched-up die pad having characteristics of a leadframe.

18. The system as claimed in claim 16 wherein the connection array is a substrate having a substrate cavity for the base integrated circuit.

19. The system as claimed in claim 16 further comprising:

a second connection array with the base integrated circuit adjacent the second connection array;

a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit; and

a second insulator over the stack module and the base integrated circuit.

20. The system as claimed in claim 16 further comprising:

a substrate with the base integrated circuit over the substrate;

a stack module having the package integrated circuit and the wire-in-film insulator over the base integrated circuit; and

a second insulator over the stack module and the base integrated circuit.