Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming an elevated contact above and between a lead and a die pad that is coplanar with the lead; connecting an integrated circuit and the lead; attaching a jumper interconnect between the elevated contact and the lead; and forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming an elevated contact above and between a lead and a die pad that is coplanar with the lead;
connecting an integrated circuit and the lead;
attaching a jumper interconnect between the elevated contact and the lead; and
forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.
2. The method as claimed in claim 1 wherein attaching the jumper interconnect includes connecting the jumper interconnect to the lead closest to the elevated contact.
3. The method as claimed in claim 1 further comprising:
providing a panel having a protrusion; and wherein:
forming the elevated contact includes forming the elevated contact on the protrusion.
4. The method as claimed in claim 1 further comprising attaching an interconnect between the integrated circuit and the elevated contact.
5. The method as claimed in claim 1 wherein forming the encapsulant includes forming the encapsulant with the recess having a cross-sectional profile of an isosceles trapezoid.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming an elevated contact above and between a lead and a die pad that is coplanar with the lead;
connecting an integrated circuit and the lead;
attaching a jumper interconnect between the elevated contact and the lead; and
forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with an exposed surface of the elevated contact exposed in the recess and the lead exposed from the base side.
7. The method as claimed in claim 6 wherein attaching the jumper interconnect includes attaching the jumper interconnect on the lead closest to the elevated contact.
8. The method as claimed in claim 6 further comprising:
providing a panel having a protrusion; and wherein:
forming the elevated contact includes forming the elevated contact on the protrusion.
9. The method as claimed in claim 6 further comprising attaching an interconnect between the integrated circuit and the lead.
10. The method as claimed in claim 6 wherein forming the encapsulant includes forming the base side with the die pad exposed.
11. An integrated circuit packaging system comprising:
an elevated contact above and between a lead and a die pad that is coplanar with the lead;
an integrated circuit connected to the lead;
a jumper interconnect attached between the elevated contact and the lead; and
an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.
12. The system as claimed in claim 11 wherein the jumper interconnect includes the jumper interconnect connected to the lead closest to the elevated contact.
13. The system as claimed in claim 11 wherein the encapsulant having the recess adjacent to the lead.
14. The system as claimed in claim 11 further comprising an interconnect attached between the integrated circuit and the elevated contact.
15. The system as claimed in claim 11 wherein the encapsulant includes the encapsulant having the recess with a cross-sectional profile of an isosceles trapezoid.
16. The system as claimed in claim 11 wherein the elevated contact is not coplanar with the lead.
17. The system as claimed in claim 16 further comprising:
a further lead; and wherein:
the elevated contact is between the lead and the further lead.
18. The system as claimed in claim 16 wherein the encapsulant includes the encapsulant formed with the die pad exposed.
19. The system as claimed in claim 16 further comprising an interconnect attached between the integrated circuit and the lead.
20. The system as claimed in claim 16 further comprising:
a further lead coplanar with the lead; and wherein:
the elevated contact is between the lead and the further lead.