Method and apparatus for determining the layer thickness and the refractive index of a sample

1. Method for determining the thickness and the refractive index of a layer ( 4 ) of a transparent material having a layer thickness between 30 nm and 150 nm which is disposed on a scattering substrate, the method comprising:

irradiating a first optical radiation onto the sample ( 4 ) which comprises said scattering substrate and said layer of a transparent material thereon, wherein the first radiation is irradiated onto the surface of the sample ( 4 ) under an angle between 0-5° with respect to normal incidence, and determining a first reflection spectrum ( 10 ) resulting from reflection of the first radiation on the sample ( 4 ),

irradiating a second optical radiation onto the sample ( 4 ), wherein the second radiation is irradiated onto the surface of the sample ( 4 ) under an oblique angle, and determining a second reflection spectrum ( 12 ) resulting from reflection of the second radiation on the sample ( 4 ),

determining a minimum of the first reflection spectrum ( 10 ),

determining a minimum of the second reflection spectrum ( 12 ), and

determining the thickness and the refractive index of the layer of a transparent material using the minimum of the first reflection spectrum ( 10 ) and the minimum of the second reflection spectrum ( 12 ).

2. The method of claim 1 , wherein the material of the layer is taken into account for determining the thickness and the refractive index of the layer of a transparent material from the minimum of the first reflection spectrum ( 10 ) and the minimum of the second reflection spectrum ( 12 ).

3. The method of claim 1 , wherein the first optical radiation and the second optical radiation are simultaneously irradiated onto the sample ( 4 ).

4. The method of claim 3 , wherein the first optical radiation and the second optical radiation are irradiated onto the same point of incidence of the sample ( 4 ) and/or wherein the sample or the apparatus is rotated with respect to the plane defined by incident and specularly reflected second optical radiation, wherein the axis of rotation is defined by the intersecting line between the plane of the sample surface and the plane defined by incident and reflected second optical radiation.

5. The method of claim 4 , wherein the second optical radiation is irradiated onto the sample ( 4 ) having an angle greater than 0° and less than 90° with respect to a direction normal to the sample ( 4 ).

6. The method of claim 5 , wherein the second optical radiation is irradiated onto the sample ( 4 ) having an angle between 20° and 88°, preferably between 50° and 84° and more preferably between 65° and 80° with respect to a direction normal to the sample ( 4 ).

7. The method of claim 6 , wherein the absolute minimum of the first reflection spectrum ( 10 ) is used as the minimum of the first reflection spectrum ( 10 ) and/or wherein the absolute minimum of the second reflection spectrum ( 10 ) is used as the minimum of the second reflection spectrum ( 10 ).

8. The method of claim 1 , wherein the first reflection spectrum ( 10 ) of the sample ( 4 ) is measured for a predetermined wavelength interval of the first irradiation and/or wherein the second reflection spectrum ( 12 ) of the sample ( 4 ) is measured for a predetermined wavelength interval of the second irradiation.

9. The method of claim 8 , wherein the wavelength interval is selected to be 300 nm to 1000 nm, preferably 400 nm to 900 nm and still more preferably 500 nm to 800 nm.

10. The method of claim 9 , wherein crystalline or multi-crystalline silicon is used as the substrate of the sample ( 4 ).

11. The method of claim 9 , wherein the surface of the sample ( 4 ) comprises a vertical and/or lateral texture between 0 nm and 10 5 nm, and/or wherein the surface of the sample ( 4 ) comprises a scattering or similar partial deflection for light in the 300 nm to 1000 nm wavelength range.

12. The method of claim 9 , wherein the sample ( 4 ) comprises a macroscopically planar surface and/or wherein the layer of a transparent material comprises a refractive index between 1.5 and 2.5 in the wavelength range between 300 nm and 1000 nm.

13. The method of claim 9 , wherein the product of layer thickness and refractive index of the layer of a transparent material is determined using the minimum of the first reflection spectrum ( 10 ).

14. The method of claim 13 , wherein a plurality of pairs of values of thickness and refractive index of the layer of a transparent material complying with the previously determined product of layer thickness and refractive index are generated, and the pair of value of which the two calculated reflection minima are equal to the measured two reflection minima is judged to be the pair of value representing the thickness and refractive index of the layer of a transparent material.

15. An apparatus adapted for determining the thickness and the refractive index of a layer ( 4 ) of a transparent material having a layer thickness between 30 nm and 150 nm which is disposed on a scattering substrate, the apparatus comprising:

a first optical light source ( 1 ) and a first optical detector ( 1 ), the first optical light source ( 1 ) and the first optical detector ( 1 ) being adapted to irradiate a first optical radiation onto a sample ( 4 ) under an angle between 0-5° with respect to normal incidence which comprises said scattering substrate and said layer of a transparent material thereon and adapted to determine a first reflection spectrum ( 10 ) resulting from reflection of the first radiation on the sample ( 4 );

a second optical light source ( 2 ) and a second optical detector ( 3 ), the second optical light source ( 2 ) and the second optical detector ( 3 ) being adapted to irradiate a second optical radiation onto the sample ( 4 ) under an oblique angle and adapted to determine a second reflection spectrum ( 12 ) resulting from reflection of the second radiation on the sample ( 4 );

characterized in that

the apparatus further comprises a data processing unit ( 5 ) adapted to determine a minimum of the first reflection spectrum ( 10 ) and a minimum of the second reflection spectrum ( 12 ), and wherein the data processing unit ( 5 ) is furthermore adapted to determine the thickness and the refractive index of the layer of a transparent material from the determined minimum of the first reflection spectrum ( 10 ) and the determined minimum of the second reflection spectrum ( 12 ).