Forming semiconductor chip connections

1. A method comprising:

depositing a plurality of dielectric layers over a chip body having a polyhedron shape with a pair of opposing sides;

etching the plurality of dielectric layers to form a hole, and etching the plurality of dielectric layers and the chip body to create a through silicon via (TSV) opening;

dicing the chip body through the TSV opening, forming a plurality of semiconductor chips and a space between the plurality of semiconductor chips;

depositing a solder layer in the hole, forming a solder ball element;

depositing the solder layer in the TSV opening and in the space between the plurality of semiconductor chips,

the depositing of the solder layer in the TSV opening including filling the TSV opening with the solder layer to form a filled TSV;

cutting through a portion of the solder layer in the filled TSV and the solder layer in the space between the plurality of semiconductor chips, forming a solder member extending completely along a side that extends between the pair of opposing sides of the chip body;

joining a first semiconductor chip in the plurality of semiconductor chips to a second semiconductor chip in the plurality of semiconductor chips, the second semiconductor chip including:

a body having a polyhedron shape with a pair of opposing sides; and

a solder member extending completely along a side that extends between the pair of opposing sides of the polyhedron shape,

wherein the joining of the first semiconductor chip and the second chip includes joining the solder members extending completely along the side of each of the first semiconductor chip and the second semiconductor chip.

2. The method of claim 1 , wherein the solder member in each of the plurality of semiconductor chips further extends over a corner formed by adjacent sides of the chip body.

3. The method of claim 1 , wherein the joining includes:

heating the solder member of the first semiconductor chip and heating the solder member of the second semiconductor chip.

4. The method of claim 3 , wherein the joining further includes:

compressing the solder member of the first semiconductor chip against the solder member of the second semiconductor chip.

5. The method of claim 1 , wherein the depositing of the solder layer in the hole is performed simultaneously with the depositing of the solder layer in the TSV opening.

6. The method of claim 1 , wherein the pair of opposing sides are substantially planar.