Semiconductor device having wiring layer with a wide wiring and fine wirings
Provided is a semiconductor device having a wiring layer formed of damascene wiring. The semiconductor device includes: a first wiring having a width equal to or larger than 0.5 μm; a second wiring adjacent to the first wiring and arranged with a space less than 0.5 μm from the first wiring; and a third wiring adjacent to the second wiring and arranged with a space equal to or smaller than 0.5 μm from the first wiring. In the semiconductor device, the second wiring and the third wiring are structured to have the same electric potential.
1. A semiconductor device comprising:
an interlayer insulating film having a first wiring trench, a second wiring trench adjacent to the first wiring trench in a first direction and a third wiring trench adjacent to the second wiring trench in the first direction;
a first wiring formed in the first wiring trench having a width, in the first direction, equal to or larger than 0.5 μm;
a second wiring formed in the second wiring trench arranged with a non-zero space less than 0.5 μm from the first wiring trench; and
a third wiring formed in the third wiring trench arranged with a non-zero space equal to or smaller than 0.5 μm from the first wiring trench,
wherein the second wiring and the third wiring are structured to have the same electric potential.
2. The semiconductor device according to claim 1 , wherein the first wiring and the second wiring are structured to have different potentials.
3. The semiconductor device according to claim 1 , wherein the space between the first wiring and the second wiring is equal to or larger than 0.2 μm.
4. The semiconductor device according to claim 1 , wherein the first wiring, the second wiring, and the third wiring are arranged parallel to one another.
5. The semiconductor device according to claim 1 , wherein a wiring pitch between the second wiring and the third wiring is less than 0.15 μm.
6. The semiconductor device according to claim 1 , wherein the second wiring and the third wiring are formed at a minimum pitch in the semiconductor device.
7. The semiconductor device according to claim 1 , wherein the second wiring and the third wiring each have a ground potential or a power supply potential.
8. The semiconductor device according to claim 1 , wherein the first wiring, the second wiring, and the third wiring comprise copper containing metal.
9. The semiconductor device according to claim 1 , wherein:
the first wiring, the second wiring, and the third wiring are arranged parallel to one another;
the space between the first wiring and the second wiring is equal to or larger than 0.2 μm; and
a wiring pitch between the second wiring and the third wiring is less than 0.15 μm.
10. The semiconductor device according to claim 9 , wherein the second wiring and the third wiring each have a ground potential.
11. The semiconductor device according to claim 1 , wherein:
the first wiring, the second wiring, and the third wiring are arranged parallel to one another;
the space between the first wiring and the second wiring is equal to or larger than 0.2 μm; and
the second wiring and the third wiring are formed at a minimum pitch.
12. A semiconductor device comprising:
an interlayer insulating film having a first wiring trench, a second wiring trench adjacent to the first wiring trench in a first direction and a third wiring trench adjacent to the second wiring trench in the first direction;
a first wiring formed in the first wiring trench having a width, in the first direction, equal to or larger than 0.5 μm;
a second wiring formed in the second wiring trench; and
a third wiring formed in the third wiring trench arranged, in the first direction, with a non-zero space equal to or smaller than 0.5 μm from the first wiring trench such that the second wiring trench is arranged, in the first direction, between the first wiring trench and the third wiring trench, wherein the second wiring and the third wiring are structured to have the same electric potential.
13. The semiconductor device according to claim 12 , wherein the first wiring and the second wiring are structured to have different potentials.
14. The semiconductor device according to claim 12 , wherein the space between the first wiring and the second wiring is equal to or larger than 0.2 μm.
15. The semiconductor device according to claim 12 , wherein a wiring pitch between the second wiring and the third wiring is less than 0.15 μm.