Memory cell that employs a selectively grown reversible resistance-switching element and methods of forming the same
A method of forming a memory cell is provided that includes forming a steering element above a substrate, and forming a reversible resistance-switching element coupled to the steering element. The reversible resistance-switching element includes one or more of TiO x , Ta 2 O 5 , Nb 2 O 5 , Al 2 O 3 , HfO 2 , and V 2 O 5 , and the reversible resistance switching element is formed without being etched. Numerous other aspects are provided.
1. A method of forming a memory cell, the method comprising:
forming a steering element above a substrate; and
forming a reversible resistance-switching element coupled to the steering element, wherein:
the reversible resistance-switching element comprises one or more of TiO x , Ta 2 O 5 , Nb 2 O 5 , Al 2 O 3 , HfO 2 , and V 2 O 5 , and
the reversible resistance switching element is formed without being etched.
2. The method of claim 1 , wherein forming the steering element comprises forming a diode.
3. The method of claim 1 , wherein forming the steering element comprises forming a polycrystalline diode.
4. The method of claim 1 , wherein forming the steering element comprises forming a vertical polycrystalline diode.
5. The method of claim 1 , wherein forming the steering element comprises forming a p-n diode or a p-i-n diode.
6. The method of claim 1 , wherein the reversible resistance-switching element has an oxide thickness of about 500 angstroms or less.
7. The method of claim 1 , wherein the reversible resistance-switching element has an oxide thickness of about 300 angstroms or less.
8. The method of claim 1 , further comprising coupling the steering element and reversible resistance-switching element in series.
9. A memory cell formed according to the method of claim 1 .