Method for detecting the under-fill void in flip chip BGA
A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back side, and a plurality of first connecting elements on the active surface of the chip; mounting and electrically connecting the active surface of the chip on the substrate; performing at least once IR reflow to fix the plurality of first connecting elements on the substrate; filling an encapsulate material to cover the active surface of the chip and the plurality of first connecting elements; performing a detecting process to detect that void is not formed between the active surface of the chip and the plurality of first elements; and forming a plurality of second connecting elements on the back side of the substrate to obtain a flip chip ball grid array package structure.
1. Method for detecting the under-fill void in flip chip BGA, comprising: providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back surface, and a plurality of first connecting elements on said active surface; mounting said chip on said substrate by inverting said chip so that said active surface of said chip faces said substrate, and said plurality of first connecting elements of said chip being electrically connected with said interconnect structure by said plurality of interposers; performing at least one IR reflow process to fix said plurality of first connecting elements on said substrate; performing a molding process to fill a molding material to encapsulate said active surface of said chip and said plurality of first connecting elements; forming a plurality of second connecting elements on a back surface of said substrate to accomplish a flip chip ball grid array package structure; and performing a detecting process to detect a void being not formed in a connecting interface between said plurality of first connecting elements and said active surface of said chip, after said step of performing said molding process, and between said step for said performing a molding to fill a molding material process and said step for said forming a plurality of second connecting elements on a back surface of said substrate.
2. The method according to claim 1 , further comprising a plurality of pads is disposed between said plurality of first connecting elements.
3. The method according to claim 1 , wherein said chip comprises CSRAM (custom SRAM).
4. The method according to claim 1 , wherein said molding material comprises epoxy resin.
5. The method according to claim 1 , wherein said detecting process comprises X-ray detecting method.
6. The method according to claim 1 , further comprises performing another filling process after said step of said performing said detecting process.
7. The method according to claim 1 , wherein said plurality of first connecting elements and said plurality of second connecting elements comprises solder ball.
8. A method for detecting an under-fill void in flip chip BGA, comprising: providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back surface, and a plurality of first connecting elements on said active surface; mounting said chip on said substrate by inverting said chip so that said active surface of said chip faces said substrate, and said plurality of first connecting elements of said chip being electrically connected with said interconnect structure by said plurality of interposers; performing at least one IR reflow process to fix said plurality of first connecting elements on said substrate; performing a first filling process to fill a molding material to encapsulate said active surface of said chip and said plurality of first connecting elements; performing a further filling process to fill said molding material to encapsulate said plurality of first connecting elements and said active surface of said chip; performing a detecting process to detect a void being not formed in a connecting interface between said plurality of first connecting elements and said active surface of said chip between said step of performing a first filling process to fill a molding material and said step of said performing a further filling process to fill said molding material; forming a plurality of support elements on said substrate, and adjacent and electrically insulated from said chip; disposing a heat dissipating element on a back surface of said plurality of support elements and said back surface of said chip; and forming a plurality of second connecting elements on a back surface of said substrate to accomplish a flip chip ball grid ball package structure.
9. The method according to claim 8 , further comprising a plurality of pads is disposed between said plurality of first connecting elements.
10. The method according to claim 8 , wherein said chip comprises CSRAM (custom SRAM).
11. The method according to claim 8 , wherein said molding material comprises epoxy resin.
12. The method according to claim 8 , wherein said detecting process comprises x-ray detecting method.
13. The method according to claim 8 , further comprising an adhesive layer is formed between said plurality of supports and said substrate.
14. The method according to claim 8 , wherein said plurality of support elements is selected from the group consisting of copper, copper-carbon, copper-tungsten, aluminum silicon carbide, aluminum, stainless, nickel, nickel-coated copper.
15. The method according to claim 8 , further comprising an adhesive layer is formed between said heat dissipating element and said back surface of said chip.
16. The method according to claim 8 , wherein said plurality of first connecting elements and said plurality of second connecting elements comprises solder ball.