Die bonder and semiconductor manufacturing method

1. A die bonder, comprising:

a bonding head that adsorbs a die from a wafer and bonds it to a substrate;

a first adjustment mechanism that positions the bonding head in order to position a position of the die at predetermined accuracy;

a second adjustment mechanism that is provided to the bonding head, and adjusts the position of the die at higher accuracy than the first adjustment mechanism;

a positioning controller that controls the first adjustment mechanism and the second adjustment mechanism;

a reference mark provided to a substrate or in the vicinity of the substrate;

a first imaging means that images the reference mark and a recognition pattern provided to a bonding position of the substrate;

a second imaging means that images the reference mark and the die brought close to the bonding position; and

a misregistration detector provided with a correcting means that corrects a position of the die brought close to the bonding position based upon imaged data acquired by the first and second imaging means.

2. The die bonder according to claim 1 , wherein the second adjustment mechanism is provided with an actuator that acts upon a shaft at an end of the bonding head from a plurality of directions and displaces the bonding head by a predetermined quantity.

3. The die bonder according to claim 2 , wherein the actuator is one of a piezo-electric device and an ultra-magnetostrictive device.

4. The die bonder according to claim 2 , comprising a restoring force means that generates restoring force for restoring the displacement of the predetermined quantity from directions opposite to the plurality of directions.

5. The die bonder according to claim 1 , wherein the recognition pattern is provided to a predetermined position so that a center position of the recognition pattern matches the center position of the tip portion of the bonding head when the die is mounted on the substrate, and the misregistration detector obtains the center position of the recognition pattern as the origin at the center point of the reference mark from the imaging result of the first imaging means, obtains the center position of the tip portion as the origin at the center point of the reference mark from the imaging result of the second imaging means, and detects misregistration of the tip portion as the difference between the center position of the tip portion and the center position of the recognition pattern.

6. The die bonder according to claim 5 , wherein the predetermined position provided with the recognition pattern is the location of a line corresponding to a diagonal of the tip portion.

7. The die bonder according to claim 1 , wherein the tip portion is the die adsorbed to the bonding head or a collet for holding the die.

8. The die bonder according to claim 5 , wherein the tip portion is the die adsorbed to the bonding head or a collet for holding the die.

9. The die bonder according to claim 1 , wherein the reference mark is formed by a light source that can irradiate spots.

10. The die bonder according to claim 5 , wherein the reference mark is formed by a light source that can irradiate the spots.

11. The die bonder according to claim 1 , wherein the first imaging means serves in a third imaging means imaging the substrate for alignment of the substrate.

12. The die bonder according to claim 5 , wherein the first imaging means serves in a third imaging means imaging the substrate for alignment of the substrate.