Apparatus for testing electronic devices
An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
1. An apparatus for testing integrated circuits of a plurality of devices, comprising;
at least one holder to hold the plurality of devices;
a tester system having a plurality of output channels and an interconnection scheme to connect the channels to a plurality of contacts of the plurality of devices, the contacts being connected to the integrated circuits;
a computer system having memory;
a test program stored in the memory, the test program having a series of instructions written for testing one of the devices;
a configuration file stored in the memory, the configuration file representing a relationship between the channels and the contacts of the plurality of devices; and
a test application that utilizes the test program and the configuration file to provide signals in accordance with the series of instructions of the test program through the channels and the interconnection scheme to the contacts of the plurality of devices and the integrated circuits.
2. The apparatus of claim 1 , wherein the interconnection scheme includes a plurality of configurable pattern generator boards, each representing a respective zone, the configuration file having a zone number field indicating a plurality of respective ones of the zones.
3. The apparatus of claim 1 , wherein the interconnection scheme has a plurality of boards inserted into a plurality of slots, the configuration file having a slot number field indicating a plurality of respective ones of the slot numbers.
4. The apparatus of claim 1 , wherein the configuration file has channel, number, and pad labeled fields to represent the relationship between the channels and the contacts of the plurality of devices.
5. The apparatus of claim 1 , wherein the devices are located in rows and columns, the configuration file having column and row fields indicating the respective row and column of each respective die.
6. The apparatus of claim 1 , wherein the interconnection scheme has a line connected to a set of the devices and a plurality of respective select lines connected to respective ones of the devices of the set, further comprising a shared resources map in the memory, the shared resources map representing a relationship between the select lines and the devices of the set.
7. The apparatus of claim 6 , wherein the select lines are grouped into chip select states.
8. The apparatus of claim 6 , wherein the shared resources map forms part of the configuration file.
9. The apparatus of claim 1 , further comprising a test results file stored in memory, and a processing application that utilizes the test results file and the configuration file to provide a test report.
10. The apparatus of claim 9 , wherein the test application utilizes the test results file to selectively modify signals in accordance with the series of instructions of the test program through the channels and the interconnection scheme to the contacts of the plurality of devices and the integrated circuits.
11. The apparatus of claim 9 , wherein the test application utilizes the test results file to selectively modify the sequence of signals in accordance with the series of instructions of the test program through the channels and the interconnection scheme to the contacts of the plurality of devices and the integrated circuits.