Separating apparatus and separating method
A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.
1. A separating apparatus for separating a supporting plate from a substrate to which the supporting plate has been attached, comprising:
a plurality of gripping devices configured to grip an outer peripheral end of the supporting plate, each of the plurality of gripping devices configured to grip the supporting plate;
a plurality of cylinders, wherein each cylinder is configured to individually move each gripping device in a linear horizontal direction toward or away from the supporting plate; and
a sucking device configured to adhere to the supporting plate by suction,
wherein the surface of the supporting plate is attached to the substrate,
wherein the outer peripheral end of the supporting plate has a chamfered portion,
wherein each of the gripping devices comprises a clamp having a vertical surface facing the supporting plate and a claw having a surface declined away from the vertical surface toward the supporting plate to grip the chamfered portion of the outer peripheral end,
wherein the plurality of gripping devices is configured to grip the outer peripheral end of the supporting plate to which the sucking device has adhered by suction, and
wherein each of the cylinders is capable of individually controlling each of the gripping devices comprising a clamp so that a displacement angle of the clamp with respect to a direction orthogonal to the surface of the supporting plate is capable of being set to a predetermined angle.
2. The separating apparatus as set forth in claim 1 , wherein the supporting plate is a supporting plate having a plurality of through holes passing therethrough in a thickness direction thereof, the separating apparatus further comprising a gas supply device configured to supply gas into a space between the supporting plate and the substrate via the plurality of through holes.
3. The separating apparatus as set forth in claim 2 , wherein the plurality of gripping devices is configured to separate the supporting plate from the substrate after or at the same time as the gas supply device starts supplying the gas.
4. The separating apparatus as set forth in claim 1 , wherein:
the sucking device has an opening via which gas is exhausted from a space between the sucking device and the supporting plate; and
the opening has a diameter of 10 mm to 30 mm.
5. The separating apparatus as set forth in claim 1 , wherein each of the plurality of gripping devices is configured to grip the supporting plate without making contact with the substrate.
6. The separating apparatus as set forth in claim 1 , which comprises three gripping devices spaced at regular intervals.
7. The separating apparatus as set forth in claim 1 , wherein each of the cylinders comprises a regulator for controlling contact force between the plurality of gripping devices and the outer peripheral end of the support plate.