Methods of conditioning a planarizing pad
Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.
1. A method of conditioning a planarizing pad, comprising:
conditioning a pad surface of a planarizing pad comprising:
a pad structure comprising:
a pad material comprising the pad surface; and
openings extending into the pad material from the pad surface; and
a partially solidified fill material partially filling the openings, and comprising:
a flowable and curable portion; and
a solidified portion over the flowable and curable portion within the openings; and
removing a portion of the partially solidified fill material from the openings to a distance from the pad surface of the pad material; and
solidifying another portion of the partially solidified fill material.
2. The method of claim 1 , wherein conditioning a pad surface of a planarizing pad comprises at least one of abrading and buffing the pad surface of the planarizing pad.
3. The method of claim 1 , wherein conditioning a pad surface of a planarizing pad comprises contacting the pad surface of the planarizing pad with a conditioning pad.
4. The method of claim 3 , wherein contacting the pad surface of the planarizing pad with a conditioning pad comprises:
rotating the conditioning pad; and
contacting the pad surface of the planarizing pad with the rotating conditioning pad while rotating the planarizing pad.
5. The method of claim 3 , wherein contacting the pad surface of the planarizing pad with a conditioning pad comprises moving the conditioning pad across different portions of the pad surface of the planarizing pad while rotating the planarizing pad.
6. The method of claim 5 , wherein moving the conditioning pad across different portions of the pad surface of the planarizing pad while rotating the planarizing pad comprises varying the dwell time of the conditioning pad at the different portions of the pad surface.
7. The method of claim 6 , wherein varying the dwell time of the conditioning pad at the different portions of the pad surface comprises making a dwell time of the conditioning pad at the center of the planarizing pad shorter than a dwell time of the conditioning pad at an edge of the planarizing pad.
8. The method of claim 1 , wherein conditioning a pad surface of a planarizing pad comprises distributing a solvent formulated to remove the partially solidified fill material of the planarizing pad using a conditioning pad.
9. The method of claim 8 , wherein distributing a solvent formulated to remove the partially solidified fill material of the planarizing pad using a conditioning pad comprises uniformly applying the solvent across the pad surface of the planarizing pad using the conditioning pad.
10. The method of claim 8 , wherein distributing a solvent formulated to remove the partially solidified fill material of the planarizing pad using a conditioning pad comprises:
applying the solvent onto the pad surface of the planarizing pad using a separate solvent delivery system; and
contacting the solvent applied onto the pad surface with the conditioning pad.
11. The method of claim 8 , wherein distributing a solvent formulated to remove the partially solidified fill material of the planarizing pad using a conditioning pad comprises delivering the solvent onto the pad surface of the planarizing pad using the conditioning pad.
12. The method of claim 11 , wherein delivering the solvent onto the pad surface of the planarizing pad using the conditioning pad comprises delivering the solvent onto the pad surface of the planarizing pad through nozzles on the conditioning pad.
13. The method of claim 8 , wherein removing a portion of the partially solidified fill material from the openings comprises removing the portion of the partially solidified fill material using the solvent.
14. The method of claim 1 , wherein solidifying another portion of the partially solidified fill material comprises curing a portion of the flowable and curable portion of the partially solidified fill material.
15. A method of conditioning a planarizing pad, comprising:
contacting a planarizing pad with a conditioning pad, the planarizing pad comprising:
a pad structure comprising:
a pad material comprising a pad surface; and
openings extending from the pad surface into the pad material, a depth of the openings less than a thickness of the pad material; and
a partially solidified fill material within the openings and comprising a hardened portion overlying a liquid portion; and
distributing a solvent for removing the partially solidified fill material of the planarizing pad onto the pad surface using the conditioning pad.
16. The method of claim 15 , wherein contacting a planarizing pad with a conditioning pad comprises contacting different portions of the pad surface of the planarizing pad with the conditioning pad at different times.
17. The method of claim 16 , wherein contacting different portions of the pad surface of the planarizing pad with the conditioning pad at different times comprises moving the conditioning pad across the pad surface of the planarizing pad.
18. The method of claim 15 , wherein distributing a solvent for removing the partially solidified fill material of the planarizing pad onto the pad surface using the conditioning pad comprises delivering the solvent onto the pad surface using the conditioning pad.
19. The method of claim 15 , wherein distributing a solvent for removing the partially solidified fill material of the planarizing pad onto the pad surface comprises simultaneously contacting the planarizing pad with the conditioning pad and distributing the solvent onto the pad surface with the conditioning pad.