Apparatus for testing electronic devices
An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
1. A board for providing power to an apparatus for testing an integrated circuit of a device comprising:
a power source to supply AC and DC power;
a power electrical path to connect the power source to a power terminal of the device;
a ground pin;
an AC ground path interconnecting terminals of the device and the ground pin; and
a DC ground path interconnecting terminals of the device and the ground pin.
2. The board of claim 1 , wherein the AC ground path and the DC ground path are electrically separated.
3. The board of claim 1 , wherein the AC ground path has a resistance between 0.5 and 1.5 ohms and the DC ground path has a resistance between 0.003 and 0.015 ohms.
4. The board of claim 1 , wherein the physical space between the AC power provision, signal line and AC power ground are small.
5. The board of claim 1 , further comprising a power board substrate, the power source, power electrical path, ground pin, and AC and DC ground paths provided on the power board substrate.