Assembly of electronic and optical devices
View Patent ↗A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.
1. A method for operating an assembly tool, the method comprising:
deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane;
deposing a second component on the assembly surface;
changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation;
lifting the first component from the assembly surface with a second tool tip of the manipulator; and
deposing the first component on the second component.
2. The method of claim 1 , further comprising applying a force with the second tool tip to the first component along the axis.
3. The method of claim 1 , wherein the assembly surface defines an assembly surface plane.
4. The method of claim 3 , wherein in the first orientation, the assembly surface plane is substantially orthogonal to the axis.
5. The method of claim 3 , wherein in the second orientation, the assembly surface plane is oblique relative to the axis.
6. The method of claim 4 , wherein the first tool tip includes an engagement surface defining a plane substantially parallel to the assembly surface in the first orientation.
7. The method of claim 5 , wherein the second tool tip includes an engagement surface defining a plane substantially parallel to the assembly surface in the second orientation.
8. The method of claim 1 , wherein the first tool tip includes an engagement surface defining a plane substantially parallel to an engagement surface of the first component while the assembly surface is arranged in the first orientation.
9. The method of claim 1 , wherein the second tool tip includes an engagement surface defining a plane substantially parallel to an engagement surface of the first component while the assembly surface is arranged in the second orientation.
10. The method of claim 1 , wherein the first component includes a component of an optical fiber array.
11. The method of claim 1 , wherein the method further includes, securing the first component to the assembly surface following the deposing the first component on the assembly surface.