High selectivity nitride etch process
An anisotropic silicon nitride etch provides selectivity to silicon and silicon oxide by forming a fluorohydrocarbon-containing polymer on silicon surfaces and silicon oxide surfaces. Selective fluorohydrocarbon deposition is employed to provide selectivity to non-nitride surfaces. The fluorohydrocarbon-containing polymer interacts with silicon nitride to form a volatile compound, thereby enabling etching of silicon nitride. The fluorohydrocarbon-containing polymer interacts with silicon oxide at a low reaction rate, retarding, or completely stopping, the etching of silicon oxide. The fluorohydrocarbon-containing polymer does not interact with silicon, and protects silicon from the plasma. The anisotropic silicon nitride etch can be employed to etch silicon nitride selective to silicon and silicon oxide in any dimension, including small dimensions less than 50 nm.
1. A method of forming a semiconductor structure comprising:
forming a shallow trench isolation structure comprising silicon oxide within a semiconductor material portion in a semiconductor substrate;
forming a gate stack on said semiconductor material portion;
forming a silicon nitride layer on said gate stack, said semiconductor material portion, and said shallow trench isolation structure; and
anisotropically etching said silicon nitride layer to form a silicon nitride spacer laterally surrounding said gate stack, wherein a top surface of said shallow trench isolation structure and a top surface of said semiconductor material portion are physically exposed and subsequently recessed during said anisotropic etching, and a first recess distance by which a top surface of said semiconductor material portion is recessed after physical exposure of said top surface of said semiconductor material portion is less than a second recess distance by which a top surface of said shallow trench isolation structure is recessed after said physical exposure of said top surface of said semiconductor material portion, and is less than a third recess distance by which a top surface of said silicon nitride spacer is recessed after said physical exposure of said top surface of said semiconductor material portion.
2. The method of claim 1 , wherein said top surface of said shallow trench isolation structure and said top surface of said semiconductor material portion are coplanar with a bottommost surface of said gate dielectric prior to said anisotropic etch.
3. The method of claim 1 , wherein second recess distance is less than said third recess distance.
4. The method of claim 1 , where said silicon nitride layer is etched employing a fluorohydrocarbon-containing plasma, wherein a first thickness of a first fluorohydrocarbon-containing polymer formed on said top surface of said semiconductor material portion is greater than a second thickness of a second fluorohydrocarbon-containing polymer formed on said top surface of said shallow trench isolation structure, and is greater than a third thickness of a third fluorohydrocarbon-containing polymer on said top surface of said silicon nitride spacer.
5. The method of claim 4 , wherein said fluorohydrocarbon-containing plasma is generated by decomposition of C x H y F z , wherein x is an integer selected from 3, 4, 5, and 6, y and z are positive integers, and y is greater than z.