Integrated circuit packaging system with flip chip and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other, each of the tips include a bottom surface;
connecting a first circuit device between the tips, the first circuit device having a first circuit device active side with a mounting pad therein and having a first circuit device non-active side, the first circuit device non-active side is coplanar with the bottom surface and another of the bottom surface of the tips;
attaching a second circuit device over the first circuit device, the second circuit device having a second circuit device active side with a contact pad therein and a device interconnect, the device interconnect directly connected to the contact pad and the mounting pad with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and
forming an encapsulation of the first thickness between the bases and over the tips.
2. The method as claimed in claim 1 further comprising:
forming a paddle adjacent to and between the bases of the external interconnects;
mounting the second circuit device over the paddle; and
wherein forming the encapsulation includes:
forming the encapsulation with the paddle exposed.
3. The method as claimed in claim 1 further comprising:
forming a paddle adjacent to and between the tips of the external interconnects;
mounting the first circuit device over the paddle; and
wherein forming the encapsulation includes:
forming the encapsulation with the paddle exposed.
4. The method as claimed in claim 1 further comprising forming the first circuit device having a horizontal dimension greater than a horizontal dimension of the second circuit device.
5. The method as claimed in claim 1 wherein:
forming the external interconnects includes forming the external interconnects having an external interconnect first side, an external interconnect second side, and an external interconnect vertical side; and
forming the encapsulation includes forming the encapsulation with the external interconnect first side, the external interconnect second side, and the external interconnect vertical side exposed.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming external interconnects each having an external interconnect first side, an external interconnect second side, an external interconnect vertical side, bases of a first thickness, and tips of a second thickness extending inwardly directly toward each other;
connecting a first circuit device between the tips with the first circuit device having a first circuit device active side with a mounting pad therein and having a first circuit device non-active side, the first circuit device non-active side is coplanar with the external interconnect first side of each of the tips;
attaching a second circuit device over the first circuit device, the second circuit device having a second circuit device active side with a contact pad therein and a device interconnect, the device interconnect directly connected to the contact pad and the mounting pad with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and
forming an encapsulation of the first thickness between the bases and over the tips.
7. The method as claimed in claim 6 further comprising:
forming a paddle adjacent to and between the bases of the external interconnects;
mounting the second circuit device over the paddle; and
wherein forming the encapsulation includes:
forming the encapsulation first side coplanar with and exposing the paddle; and
forming the encapsulation second side coplanar with and exposing the first circuit device non-active side.
8. The method as claimed in claim 6 further comprising:
forming a paddle adjacent to and between the tips of the external interconnects;
mounting the first circuit device over the paddle; and
wherein forming the encapsulation includes:
forming the encapsulation first side coplanar with and exposing the paddle; and
forming the encapsulation second side coplanar with and exposing the second circuit device.
9. The method as claimed in claim 6 wherein forming the encapsulation includes:
forming the encapsulation first side coplanar with the external interconnect first side; and
forming the encapsulation second side coplanar with the external interconnect second side.
10. The method as claimed in claim 6 wherein attaching the second circuit device includes connecting a flip chip.
11. An integrated circuit packaging system comprising:
external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other, each of the tips include a bottom surface;
a first circuit device connected between the tips, the first circuit device having a first circuit device active side with a mounting pad therein and having a first circuit device non-active side, the first circuit device non-active side is coplanar with the bottom surface and another of the bottom surface of the tips;
a device interconnect directly connected to the mounting pad;
a second circuit device over the first circuit device, the second circuit device having a second circuit device active side with a contact pad therein and a device interconnect, the device interconnect directly connected to the contact pad and the mounting pad with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and
an encapsulation of the first thickness between the bases and over the tips.
12. The system as claimed in claim 11 further comprising:
a paddle adjacent to and between the bases of the external interconnects and exposed from the encapsulation; and
wherein the second circuit device is mounted over the paddle.
13. The system as claimed in claim 11 further comprising:
a paddle adjacent to and between the tips of the external interconnects and exposed from the encapsulation; and
wherein the first circuit device is mounted over the paddle.
14. The system as claimed in claim 11 further comprising the first circuit device having a horizontal dimension greater than a horizontal dimension of the second circuit device.
15. The system as claimed in claim 11 wherein the external interconnects includes an external interconnect first side, an external interconnect second side, and an external interconnect vertical side with the external interconnect first side, the external interconnect second side, and the external interconnect vertical side exposed from the encapsulation.
16. The system as claimed in claim 11 wherein:
the external interconnects includes an external interconnect first side, an external interconnect second side, and an external interconnect vertical side;
the second circuit device includes a second circuit device active side and a second circuit device non-active side; and
the encapsulation includes an encapsulation first side and an encapsulation second side.
17. The system as claimed in claim 16 further comprising:
a paddle adjacent to and between the bases of the external interconnects and exposed from the encapsulation first side; and
wherein:
the second circuit device is mounted over the paddle;
the encapsulation having the encapsulation second side is coplanar with and exposing the first circuit device non-active side.
18. The system as claimed in claim 16 further comprising:
a paddle adjacent to and between the tips of the external interconnects and exposed from the encapsulation first side; and
wherein:
the first circuit device is mounted over the paddle; and
the second circuit device is exposed from and coplanar with the encapsulation second side.
19. The system as claimed in claim 16 wherein the encapsulation includes:
the encapsulation first side coplanar with the external interconnect first side; and
the encapsulation second side coplanar with the external interconnect second side.
20. The system as claimed in claim 16 wherein the second circuit device includes a flip chip.