Forming semiconductor chip connections
Systems and methods are disclosed that enable forming semiconductor chip connections. In one embodiment, the semiconductor chip includes a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.
1. A method of forming a semiconductor structure, the method comprising:
forming a plurality of semiconductor chips by:
depositing a plurality of dielectric layers over a chip body having a polyhedron shape with a pair of opposing sides;
etching the plurality of dielectric layers to form a hole, and etching the plurality of dielectric layers and the chip body to create a through silicon via (TSV) opening;
dicing the chip body through the TSV opening, forming the plurality of semiconductor chips and a space between the plurality of semiconductor chips;
depositing a solder layer in the hole, forming a solder ball element;
depositing the solder layer in the TSV opening and in the space between the plurality of semiconductor chips after the dicing of the chip body through the TSV opening,
the depositing of the solder layer in the TSV opening including filling the TSV opening with the solder layer to form a filled TSV; and
cutting through a portion of the solder layer in the filled TSV and the solder layer in the space between the plurality of semiconductor chips, forming a solder member extending completely along a side that extends between the pair of opposing sides of the chip body;
connecting the plurality of semiconductor chips, each semiconductor chip including:
a body having a polyhedron shape with a pair of opposing sides;
a solder member extending completely along a side that extends between the opposing sides of the polyhedron shape; and
a solder ball element located on a surface of one of the pair of opposing sides;
the connecting including:
heating the solder ball element of a first semiconductor chip and heating the solder ball element of a second semiconductor chip; and
compressing the solder ball element of the first semiconductor chip against the solder ball element of the second semiconductor chip;
connecting a connector chip to one of the plurality of semiconductor chips, the connector chip including:
a body having a polyhedron shape with a pair of opposing substantially planar sides;
a solder member extending completely along a side that extends between the opposing substantially planar sides of the polyhedron shape; and
a solder ball element located on a surface of one of the pair of opposing substantially planar sides,
the connecting of the connector chip to one of the plurality of semiconductor chips including:
heating the solder ball element of the connector chip and heating the solder member extending completely along the side that extends between the opposing substantially planar sides of the polyhedron shape of one of the plurality of semiconductor chips; and
compressing the solder ball element of the connector chip against the solder member of one of the plurality of semiconductor chips,
wherein the connector chip forms a substantially right angle with the one of the plurality of semiconductor chips;
connecting the connector chip and the one of the plurality of semiconductor chips to a substrate,
wherein the connector chip is connected to the substrate by the solder member of the connector chip that extends completely along the side that extends between the opposing substantially planar sides of the polyhedron shape, and
wherein the one of the plurality of semiconductor chips is connected to the substrate by the solder ball element of the semiconductor chip.
2. The method of claim 1 , wherein the solder member in each of the plurality of semiconductor chips further extends over a corner formed by adjacent sides of the body of each semiconductor chip.