Integrated circuit packaging system with island terminals and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a package paddle having a peripheral portion, a central portion, and an upper hole, wherein the peripheral portion is spaced away from the central portion, and the upper hole is below a paddle top side, horizontally between the peripheral portion and the central portion, and bounded by an upper non-horizontal side with a curve surface;

forming a terminal adjacent the package paddle;

mounting an integrated circuit on the paddle top side; and

forming an encapsulation within the upper hole.

2. The method as claimed in claim 1 wherein:

providing the package paddle includes providing the package paddle having a lower hole opposite the upper hole; and

forming the encapsulation includes forming the encapsulation exposed within the lower hole.

3. The method as claimed in claim 1 wherein providing the package paddle includes providing the package paddle having a paddle peripheral lower portion with a horizontal width less than a horizontal width of a paddle peripheral upper portion.

4. The method as claimed in claim 1 wherein providing the package paddle includes providing the package paddle having a paddle central lower portion with a horizontal width less than a horizontal width of a paddle central upper portion.

5. The method as claimed in claim 1 wherein:

providing the package paddle includes providing the package paddle having a paddle peripheral portion; and

forming the encapsulation includes forming the encapsulation completely covering the paddle peripheral portion.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a package paddle having a peripheral portion, a central portion, and an upper hole, wherein the peripheral portion is spaced away from the central portion, and the upper hole is below a paddle top side, horizontally between the peripheral portion and the central portion, and bounded by an upper non-horizontal side with a curve surface;

forming a terminal adjacent the package paddle;

mounting an integrated circuit on the paddle top side;

attaching a terminal-device connector to the integrated circuit and the terminal; and

forming an encapsulation within the upper hole.

7. The method as claimed in claim 6 wherein:

providing the package paddle includes providing the package paddle having a paddle bottom conductive layer; and

forming the encapsulation includes forming the encapsulation having an encapsulation bottom side coplanar with the paddle bottom conductive layer.

8. The method as claimed in claim 6 wherein:

providing the package paddle includes:

forming a paddle peripheral lower portion having a horizontal width less than a horizontal width of a paddle peripheral upper portion, and

forming a paddle central lower portion adjacent the paddle peripheral lower portion, the paddle central lower portion having a horizontal width less than a horizontal width of a paddle central upper portion.

9. The method as claimed in claim 6 wherein:

providing the package paddle includes providing the package paddle having a paddle bottom conductive layer; and

forming the encapsulation includes forming the encapsulation having an encapsulation bottom side coplanar with the paddle bottom conductive layer.

10. The method as claimed in claim 6 wherein:

providing the package paddle includes providing the package paddle having a paddle peripheral upper portion; and

further comprising:

forming an additional encapsulation covering a bottom extent of the paddle peripheral upper portion.

11. An integrated circuit packaging system comprising:

a package paddle having a peripheral portion, a central portion, and an upper hole, wherein the peripheral portion is spaced away from the central portion, and the upper hole is below a paddle top side, horizontally between the peripheral portion and the central portion, and bounded by an upper non-horizontal side with a curve surface;

a terminal adjacent the package paddle;

an integrated circuit on the paddle top side; and

an encapsulation within the upper hole.

12. The system as claimed in claim 11 wherein:

the package paddle includes a lower hole opposite the upper hole; and

the encapsulation is exposed within the lower hole.

13. The system as claimed in claim 11 wherein the package paddle includes a paddle peripheral lower portion with a horizontal width less than a horizontal width of a paddle peripheral upper portion.

14. The system as claimed in claim 11 wherein the package paddle includes a paddle central lower portion with a horizontal width less than a horizontal width of a paddle central upper portion.

15. The system as claimed in claim 11 wherein:

the package paddle includes a paddle peripheral portion; and

the encapsulation completely covers the paddle peripheral portion.

16. The system as claimed in claim 11 further comprising a terminal-device connector attached to the integrated circuit and the terminal.

17. The system as claimed in claim 16 wherein:

the package paddle includes a paddle bottom conductive layer; and

the encapsulation includes an encapsulation bottom side coplanar with the paddle bottom conductive layer.

18. The system as claimed in claim 16 wherein:

the package paddle includes:

a paddle peripheral lower portion having a horizontal width less than a horizontal width of a paddle peripheral upper portion, and

a paddle central lower portion adjacent the paddle peripheral lower portion, the paddle central lower portion having a horizontal width less than a horizontal width of a paddle central upper portion.

19. The system as claimed in claim 16 wherein:

the package paddle includes a paddle bottom conductive layer; and

the encapsulation includes an encapsulation bottom side coplanar with the paddle bottom conductive layer.

20. The system as claimed in claim 16 wherein:

the package paddle includes a paddle peripheral upper portion; and

further comprising:

an additional encapsulation covering a bottom extent of the paddle peripheral upper portion.

21. A method of manufacture of an integrated circuit packaging system comprising:

providing a package paddle having a peripheral portion, a central portion, a paddle bottom side, a paddle bottom conductive layer, and a lower non-horizontal side with the lower non-horizontal side having a curve surface, wherein the peripheral portion is spaced away from the central portion, and the upper hole is horizontally between the peripheral portion and the central portion surface;

forming a terminal adjacent the package paddle, the terminal having a terminal bottom side and a terminal lower portion with the terminal lower portion having a non-horizontal extent facing the lower non-horizontal side;

mounting an integrated circuit over the package paddle; and

forming an encapsulation over the integrated circuit, the encapsulation covering the non-horizontal extent and the lower non-horizontal side, the encapsulation having an encapsulation bottom side horizontally extending from the paddle bottom side to the terminal bottom side.

22. An integrated circuit packaging system comprising:

a package paddle having a peripheral portion, a central portion, a paddle bottom side, a paddle bottom conductive layer, and a lower non-horizontal side with the lower non-horizontal side having a curve surface, wherein the peripheral portion is spaced away and the upper hole is horizontally between the peripheral portion and the central portion;

a terminal adjacent the package paddle, the terminal having a terminal bottom side and a terminal lower portion with the terminal lower portion having a non-horizontal extent facing the lower non-horizontal side;

an integrated circuit over the package paddle; and

an encapsulation over the integrated circuit, the encapsulation covering the non-horizontal extent and the lower non-horizontal side, the encapsulation having an encapsulation bottom side horizontally extending from the paddle bottom side to the terminal bottom side.