Field effect transistor structure and method of forming same
View Patent ↗The disclosure relates generally to a metal-oxide-semiconductor field effect transistor (MOSFET) structures and methods of forming the same. The MOSFET structure includes at least one semiconductor body on a substrate; a dielectric cap on a top surface of the at least one semiconductor body, wherein a width of the at least one semiconductor body is less than a width of the dielectric cap; a gate dielectric layer conformally coating the at least one semiconductor body; and at least one electrically conductive gate on the gate dielectric layer.
1. A method for forming a metal-oxide-semiconductor field effect transistor (MOSFET) structure, the method comprising:
providing a semiconductor substrate;
forming a patterned masking layer on the semiconductor substrate;
etching a semiconductor layer of the semiconductor substrate to form at least one semiconductor body;
removing the patterned masking layer;
depositing an oxidation blocking material around and in direct contact with the at least one semiconductor body;
etching back the oxidation blocking material to expose an upper portion of the at least one semiconductor body;
oxidizing the upper portion of the at least one semiconductor body so as to form a dielectric cap having a match stick head shaped cross section over the remaining portion of the at least one semiconductor body,
wherein the match stick head shaped cross section includes a combination of the at least one semiconductor body and the dielectric cap, wherein the match stick shaped head cross section is wider at a portion distal from the semiconductor substrate than a portion proximal to the semiconductor substrate, and wherein a material of the semiconductor cap tapers along the at least one semiconductor body from a portion of the at least one semiconductor body distal to the semiconductor substrate to a portion of the at least one semiconductor body proximal to the semiconductor substrate,
wherein a width of the remaining portion of the at least one semiconductor body is less than a width of the dielectric cap;
removing the oxidation blocking material;
forming a gate dielectric layer on the remaining portion of the at least one semiconductor body and the dielectric cap; and
forming at least one electrically conducting gate on the gate dielectric layer, wherein the gate dielectric layer is on the remaining portion of the at least one semiconductor body and the dielectric cap, and wherein the width of the remaining portion of the at least one semiconductor body is less than a width of the dielectric cap.
2. The method according to claim 1 , further comprising forming a source region and a drain region on opposite sides of a channel region of the remaining portion of the at least one semiconductor body, and forming the at least one electrically conductive gate over the channel region.
3. The method according to claim 1 , wherein the semiconductor body includes a silicon fin.
4. The method according to claim 1 , wherein the dielectric cap comprises a shape selected from one of a sphere, a rectangle, a square, and an oblong.
5. The method according to claim 1 , wherein the width of the at least one silicon fin is in a range from approximately 5 nm to approximately 20 nm and the width of the dielectric cap is in a range from approximately 6 nm to approximately 25 nm.
6. The method according to claim 1 , wherein the forming of the gate dielectric layer includes conformally depositing the gate dielectric layer on the remaining portion of the at least one semiconductor body and the dielectric cap.
7. The method according to claim 1 , further comprising a second etching back of the oxidation blocking material to expose a second remaining portion of the at least one semiconductor body after the dielectric cap forming step.
8. The method according to claim 7 , further comprising oxidizing the second remaining portion of the at least one semiconductor body so as to extend the dielectric cap over the second remaining portion of the at least one semiconductor body.
9. A method for forming a metal-oxide-semiconductor field effect transistor (MOSFET) structure, the method comprising:
providing a semiconductor substrate;
forming a patterned masking layer on the semiconductor substrate;
etching a semiconductor layer of the semiconductor substrate to form at least one semiconductor body;
removing the patterned masking layer;
depositing an oxidation blocking material around and in direct contact with the at least one semiconductor body;
etching back the oxidation blocking material to expose an upper portion of the at least one semiconductor body;
oxidizing the upper portion of the at least one semiconductor body so as to form a dielectric cap having a match stick head shaped cross section over the remaining portion of the at least one semiconductor body, wherein the match stick head shaped cross section includes a combination of the at least one semiconductor body and the dielectric cap, wherein the match stick shaped head cross section is wider at a portion distal from the semiconductor substrate than a portion proximal to the semiconductor substrate, and wherein a material of the semiconductor cap tapers along the at least one semiconductor body from a portion of the at least one semiconductor body distal to the semiconductor substrate to a portion of the at least one semiconductor body proximal to the semiconductor substrate,
and wherein a width of the at least one semiconductor body is less than a width of the dielectric cap;
removing the oxidation blocking material;
conformally depositing a gate dielectric layer on the remaining portion of the at least one semiconductor body; and
forming at least one electrically conducting gate on the gate dielectric layer, wherein the gate dielectric layer is on the remaining portion of the at least one semiconductor body and the dielectric cap, and wherein the width of the remaining portion of the at least one semiconductor body is less than a width of the dielectric cap.