Integrated circuit including DRAM and SRAM/logic
A method includes providing a substrate having an N+ type layer; forming a P type region in the N+ type layer disposed within the N+ type layer; forming a first deep trench isolation structure extending through a silicon layer and into the N+ type layer to a depth that is greater than a depth of the P type layer; forming a dynamic RAM FET in the silicon layer, forming a first logic/static RAM FET in the silicon layer above the P type region, the P type region being functional as a P-type back gate of the first logic/static RAM FET; and forming a first contact through the silicon layer and an insulating layer to electrically connect to the N+ type layer and a second contact through the silicon layer and the insulating layer to electrically connect to the P type region.
1. A method to fabricate an integrated circuit comprising field effect transistors (FETs) at least some of which comprise a part of random access memory (RAM) and logic devices, comprising:
providing a substrate having an N+ type layer;
forming a P type region in the N+ type layer as a P type layer having a thickness that is disposed within the N+ type layer;
forming by wafer bonding an insulator layer overlying the N+ type layer having a silicon layer overlying the insulator layer, where the insulator layer has a first surface in contact with a surface of the P type layer and a second surface opposite the first surface in contact with the silicon layer;
forming a first deep trench isolation structure extending through the silicon layer, the insulating layer and into the N+ type layer to a depth that is greater than a depth at which the P type layer is disposed, the first deep trench isolation structure abutting a first edge of the P type layer;
forming a dynamic RAM FET in the silicon layer connected with a conductive node of a trench capacitor that is formed to extend into the N+ type layer, the N+ type layer being a plate electrode of the trench capacitor,
forming a first logic/static RAM FET in the silicon layer above the P type region, the P type region functional as a P-type back gate of the first logic/static RAM FET; and
forming a first contact through the silicon layer and the insulating layer to electrically connect to the N+ type layer and a second contact through the silicon layer and the insulating layer to electrically connect to the P type region.
2. The method as in claim 1 , further comprising forming a deep trench isolation structure to extend through the silicon layer, the insulating layer and into the N+ type layer to a depth that is greater than a depth at which the P type layer is disposed, the deep trench isolation structure abutting an edge of the P type layer.
3. The method as in claim 1 , further comprising forming an intrinsic layer disposed within the N+ type layer between the P type layer and the N+ type layer.
4. The method as in claim 1 , where forming the P type region comprises implanting the P-type region.
5. The method as in claim 1 , where the step of forming by wafer bonding comprises thinning the silicon layer.