Enhanced etch and deposition profile control using plasma sheath engineering
A plasma processing tool is used to deposit material on a workpiece. For example, a method for conformal deposition of material is disclosed. In this embodiment, the plasma sheath shape is modified to allow material to impact the workpiece at a range of incident angles. By varying this range of incident angles over time, a variety of different features can be deposited onto. In another embodiment, a plasma processing tool is used to etch a workpiece. In this embodiment, the plasma sheath shape is altered to allow ions to impact the workpiece at a range of incident angles. By varying this range of incident angles over time, a variety of differently shaped features can be created.
1. A method of etching a three dimensional feature, having a desired width, depth and taper, in a workpiece, comprising:
generating a plasma having a plasma sheath adjacent to a front surface of the workpiece; and
modifying a shape of a boundary between the plasma and the plasma sheath while accelerating material from the plasma across the boundary to etch the three dimensional feature on the front surface of the workpiece wherein the material strikes the three dimensional feature at a range of incident angles, and wherein the range of incident angles is dependent on the shape of the boundary between the plasma and the plasma sheath.
2. The method of claim 1 , wherein the range of incident angles includes a center angle and a distribution about the center angle.
3. The method of claim 2 , wherein the three dimensional feature is inwardly tapered, such that its desired width at the front surface of the workpiece is greater than its desired width at a bottom of the three dimensional feature, and the center angle is perpendicular to a plane defined by the front surface of the workpiece and the distribution is greater than zero degrees.
4. The method of claim 2 , wherein the three dimensional feature is outwardly tapered, such that its desired width at the front surface of the workpiece is less than its desired width at a bottom of the three dimensional feature, and the range of incident angles comprises two center angles, each having a distribution.
5. The method of claim 2 , wherein the modification of the boundary comprises:
selecting a first center angle and a first distribution based on the desired taper; and
directing material toward the three dimensional feature using the first center angle and the first distribution, whereby the material etches the workpiece to a first depth.
6. The method of claim 5 , further comprising:
selecting a second center angle and a second distribution based on the desired taper and the first depth; and
directing material toward the three dimensional feature using the second center angle and distribution, whereby the material etches the workpiece to a second depth.
7. The method of claim 6 , further comprising repeating the selecting and directing steps a plurality of times until a desired depth has been etched.
8. The method of claim 7 , wherein the distribution is reduced over time.
9. The method of claim 7 , wherein the incident angle is reduced over time.